08/16/2011, Rocky Hill, Conn.
Loctite® Adhesive Eliminates Acids and Minimizes Wafer Damage
|Adhesive Technologies – Industrial North America|
New Hot Water Debondable Epoxy Simplifies Solar Silicon Wafer Slicing
Loctite® 3382™ replaces traditional epoxies that require caustic acids for debonding. This adhesive breaks down easily on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during the wafer cleaning process.
As this two-part epoxy is pink when cured, it is easy to distinguish from the silicon ingot and the metal and glass mounting substrates during visual inspections. Easy to dispense using meter-mix equipment, Loctite® 3382™ is packaged in cartridges, pails and drums. This adhesive emits no caustic odor, will not corrode equipment, and is fully-compatible with current wafer cleaning solutions and processes.
Homogenous and stable, Loctite® 3382™ sets up in just 5 to 7 hours and provides a consistent cutting layer that reduces edge damage and wafer breakage. This epoxy’s excellent bond strength means the adhesive will not prematurely debond during the sawing process, protecting the ingot and the wafers from damage.
For more information on Loctite® 3382™, call 1-800-562-8483 or visit www.henkelna.com/solar.
Henkel operates worldwide with leading brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries, and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 48,000 people and reported sales of $20.07 billion and adjusted operating profit of $2.27 billion in fiscal 2010. Henkel’s preferred shares are listed in the German stock index DAX and the company ranks among the Fortune Global 500.