Technomelt® Supra™  – The universal specialist

Technomelt® Supra™ combines the proven quality of the Technomelt product line, renowned for easy processing and excellent bond strength, with even higher thermal stability and a greater adhesion range.  Technomelt Supra's performance potential satisfies many more demands of the packaging industry.

Technomelt Supra – reduces your total costs 

• Technomelt Supra has much higher thermal stability than conventional adhesives. It doesn't gel, reduces cracking and treats applicators and nozzles gently. It prolongs the equipment's service life and diminishes the need for spare parts.
• Technomelt Supra minimizes set-up time; with faster melting, production after machine shutdown (e.g. on weekends) can restart faster.
• Technomelt Supra has a considerably larger application range than conventional hotmelts. A huge diversity of substrates and packages (wraparound cartons and trays, and even paper and cardboard with coated or varnished surfaces) can now be bonded with a single adhesive, making it possible to fully convert whole production facilities to Technomelt Supra with all the associated benefits (e.g. lower storage requirements and no risk of confusion). Even two shot applications, i.e. the combined system of dispersions and hotmelts, can be dispensed with in many cases, as Technomelt Supra covers a larger temperature range than standard hotmelts.
• Technomelt Supra is virtually colorless and odorless. It is excellently suited to the packaging of foods and confectionery.
• Technomolt Supra has an extra-high yield; with its superior bond strength, adhesives consumption can be reduced without compromising on performance.
• At the same time, Technomelt Supra has a lower density than standard hotmelts; therefore the quantity applied weighs less per unit of volume, which reduces adhesive consumption.
• Technomolt Supra is particularly suitable for difficult applications situations, e.g. high memory forces or lack of counter-pressure.