(3.1 MB)

Catalog covers Henkel's broad range of PCB Assembly solutions.

(LT-5012)

(2.6 MB)

Catalog covers Henkel's wide range of solutions for the Semiconductor Industry.

(LT-5013)

(0.595 MB)

Surpassing the highest standards of design and manufacturing engineers, Loctite® Bead-on-Bead High Performance Thermally Conducive Adhesives offer both ease of use and outstanding performance.

(LT-4393)

(0.57 MB)

Key features and characteristics of Loctite® Chipbonder® Surface Mount Adhesives, for applications that require ultra-fast capability.

(LT-4693)

(3.26 MB)

Innovative Modeling and Prototyping Services from Henkel Understand optimal materials sets for various substrates; develop better and more reliable packages; obtain critical test data – all before investing in large-scale package production!

(LT-4277)

(0.79 MB)

Henkel offers a full line of lead-free products, under the Multicore®, Hysol® and Loctite® brands, for electronics packaging and assembly. These include solder pastes, surface mount adhesives, underfill materials, molding compounds and liquid encapsulants.

(LT-4273)

(0.61 MB)

A new approach to package design and production reliability.

(LT-3811)

(0.58 MB)

Loctite® 3536™ Adhesive is a fast flow epoxy underfill for BGA and CSP devices. This brochure provides general information, key features and benefits.

(LT-4733)

(0.72 MB)

Discover the key features, benefits and advantages of Loctite® 3549™, a fast-flow, reworkable CSP epoxy underfill for BGA and CSP devices.

(LT-4418)

(0.56 MB)

A guide to Loctite® Phase Change Thermal Interface Materials, formulated for such applications as microprocessors, telecom and RF components, power semiconductors, IGBTs and converters.

(LT-4738)

(1.94 MB)

A complete solution for the gentle over-molding and encapsulation of delicate electronic components.

(LT-4182)

(1.2 MB)

Henkel’s advanced semiconductor packaging and assembly materials are delivering the solutions needed to address the demanding requirements of next-generation medical electronics.

(LT-5892)

(0.62 MB)

Key features and characteristics of Multicore® High-Performance Liquid Fluxes, available in a variety of formulations for various wave soldering processes.

(LT-4726)

(0.16 MB)

Learn how Henkel’s Multicore® Lead-Free Solder Wire can improve processes of production, reworking and repair.

(LT-4394)

(2.19 MB)

The lead-free solder paste you can rely on in any production environment.

(LT-4144)

(0.62 MB)

Key features and characteristics of Henkel’s Multicore® LF328™, a Low Voiding Lead-Free Solder Paste suitable for a wide range of reflow profiles and surface finishes.

(LT-4591)

(0.33 MB)

Key features and characteristics of Henkel’s Multicore® WS300™, a Pb-Free Water Wash Solder Paste suitable for high-speed, fine-pitch printing applications.

(LT-4459)

(282KB)
Henkel offers a complete range of high quality conductive coatings and dispersions for today’s continually advancing energy storage device and electronics industry.
(LT-5708)