General purpose seal gum

High performance defoamer for corrugating starch adhesive.

MULTICORE 97SC (SAC305) alloy is designed to be a lead free substitute for tin/lead alloys in most electronics assembly soldering operations.

Thermosetting, synthetic resin-based, friction bonding adhesive shoe dip formulation

Ablebond 2000T is a high thermal conductivity adhesive. Low bleed on silver substrates.

Self-filleting low modulus adhesive for attaching large die on thin organic substrates.

Non-conductive die attach adhesive paste.

Fast B-stageable printable paste with no die attach cure required. Low outgassing.

ABLESTIK 84-1LMISR4-S25 electrically conductive die attach adhesive.

ABLESTIK ABL-2100A die attach adhesive is low bleed, low cost, low stress designed for Pb-free array packaging.

ABLESTIK ABLEBOND 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging.

A hybrid chemistry die attach paste adhesive designed for PBGA.

Die attach adhesive has been formulated for use in high throughput die attach applications.

Non-conductive die attach adhesive has been formulated for use in high throughput die attach applications.

Ablebond 2053S is a low stress paste adhesive for die-to-substrate applications.

Ablebond 2300 is an ultra low moisture absorption, low stress paste adhesive.

Ablebond 3005 is for large packages and lead-free applications.

ABLESTIK ABLEBOND 3230A adhesive die attach is designed for semiconductor packaging applications where high electrical conductivity is not required. It can be used in a variety of package sizes.

ABLESTIK ABLEBOND 342-37 epoxy adhesive is designed for applications requiring outstanding thermal shock properties.

Electrically conductive, paste adhesive designed for solder replacement in microelectronic interconnect applications

Electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements.

Ablebond 8290 is a low stress die attach adhesive suitable for die size <200 mil.

ABLESTIK ABLEBOND 8350M electrically conductive one component die attach adhesive has been formulated for use in high throughput die attach applications.

Ablebond 8352L is a high electrical and thermal conductivity die attach adhesive.

ABLESTIK ABLEBOND 8387A is a non-conductive die attach adhesive designed for high throughput smart card bonding applications.

Single component die attach adhesive designed for high throughput bonding applications.

Adhesive for high volume semiconductor applications, fast cure.

ABLESTIK ABLEBOND 84-1LMSR3 electrically conductive adhesive is designed for die attach applications. It is a low viscosity and higher thixotropic index version of ABLEBOND 84-1LMIS.

Electrically conductive adhesive.

Electrically non-conductive adhesive pastes for screen printing, dispensing and insulating applications.

Dispensible, fast curing, general conductive, paste adhesive and meets the requirements of MIL-STD-883, Method 5011.

Non-conductive die attach adhesive.

ABLESTIK ABLEBOND 958-8C is an electrically conductive epoxy designed for solder replacement in microelectronic interconnect applications.

Two components, low temperature cure paste adhesive.

ABLESTIK ABLEBOND 969-1 is an electrically conductive preimidized adhesive designed for semiconductor die attach. It is not recommended for use in hermetic packages.

Ablebond FS849-TI is a high thermal conductivity adhesive with low electrical resistance.

Ablebond MC723 is for bondline control achieved with 75 micron spacers.

Ablecoat 8008HT is a high thermal conductivity snap cure adhesive utilizing wafer backside coating technology.

One component, high flow liquid underfill encapsulant with superior moisture resistance.

Ablestik UF8828 is for eutectic, high lead or lead-free packaging. Higher modulus.

A high purity adhesive film with excellent adhesion to gold-plated surfaces, particularly suited for use in hermetic packages.

A flexible film adhesive designed for bonding TCE mismatched materials.

Combines high adhesion strength with very good thermal conductivity in a fiberglass supported film adhesive.

ABLESTIK ABLEFILM 561 is a thermally conductive epoxy film designed for bonding materials with mismatched coefficients of thermal expansion.

Supported, thermally conductive dielectric adhesive film.

Heat cure epoxy film.

Supported, electrically and thermally conductive adhesive film.

Ablefilm ECF564A is an ionically clean, fiberglass supported adhesive with very good thermal conductivity.

Ablefilm ECF568 was designed for low temperature cure applications. It has superior adhesion to most surfaces.

Die attach adhesive.

ABLESTIK ABLELUX A4083T photocurable adhesive is formulated to enhance productivity in the assembly of optical, fiber optic and optoelectronic devices.

Non-conductive photocurable adhesive.

Photocurable adhesive for wafer level assembly glass lid attach applications.

ABLESTIK ABP 8611 adhesive is designed for die attach applications as well as component attach.

ABLESTIK ABP-8000 conductive die attach is desgined for bonding devices where high heat transfer is required. It is recommended for use in the attachment of integrated circuits and components onto metallic leadframes.

ABLESTIK ACP-3122 anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications.

Single layer adhesvie film for mother/daughter die stacking applications.

Non Conductive DDF: DAX film (5 µm).

Non Conductive DDF: DAX (5 µm).

Non Conductive DDF: DAX film (10 µm).

Non Conductive DDF: DAX (10 µm).

Non-conductive die attach film (20 µm).

Non Conductive DDF: DAX (20 µm)

Non Conductive DDF: DAX (25 µm).

Non Conductive DDF: DAX (30 µm)

Dual layer format. Low warpage adhesive. Excellent wettability.

Ablestik C100 series (C115 and C130) conductive die attach films. Ablestik C115 supplied in 15 micro thickness enables leadframe package manufacturers to realize the advantages film-based products have over traditional paste die attach products. Benefits include the elimination of die tilt, the ability to process thinner die and facilitation of greater bondline control all of which allow for improved processability, higher yields and better long-term reliability.

ABLESTIK ECI-1001 screen printable, conductive ink is designed for use on membrane touch switch and other flex circuit applications. It offers excellent balance of flexibility, hardness and adhesion.

ABLESTIK ICP-3535M1 electrically conductive adhesive is designed for circuit assembly applications. It is specially recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. Designed for applications with small size components (0603, 0402) where no bleeding or wicking is tolerated. It can be applied by stencil printing.

ABLESTIK ICP-4001 silicone paste is specifically desgined for applications where a high degree of flexibility is required.

Ablestik UF8806J is for large flip chip in package applications. Ultra low alpha emissions.

High thermal conductivity adhesive for thermal management applications

ABLESTIK ABLETHERM 2700HT die attach is desgined for Pb-free array packaging. This adhesive is ideal for small needle dispensing in SIP or MCM die attach applications.

Low gloss dry film lubricant weatherstip coating.

Water based graphite coating/additive.

Screen printable, UV curable dielectric ink for plastic film and paper substrates. Excellent flexibility.

Screen printable silver ink for ITO treated plastic film.

High temperature silver conductive coating

ACHESON ELECTRODAG 5810 two component adhesive is designed to cure at ambient temperatures.

Screen printable carbon ink for PET film.

Screen printable, silver filled polymer thick film ink.

Screen printable silver ink for ITO treated plastic film. Good fine line printing capability.

Silver/silver chloride ink for flexographic/rotogravure printing on plastic film.

ACHESON Eelectrodag PE-428 is a blend of silver and silver chloride pigment in a resin system designed for printing on flexible substrates. It is suitable for applications using flexographic or rotogravure printing techniques.

Conductive screen printable ink.

Screen printable, UV curable dielectric ink for plastic film. Excellent humidity resistance.

Screen printable, highly resistive ink for PET film.

Screen printable, carbon ink for rigid printed circuit boards.

Carbon polymer thick film ink

ACHESON MINICO M2000RS MOD2 are a series of one component screen printable resistive carbon inks.

MINICO M2000 RS MOD 2 are a series of one component screen printable resistive carbon inks.

MINICO M2000RS MOD2 are a series of one component screen printable resistive carbon inks.

ACHESON MINICO M4100RS is a one-component, silver-filled, electroless nickel plateable conductive polymer.

Flexible, printable water-based silver ink.

Flexible, low friction, dry film lubricant weatherstip coating for use on colored EPDM and TPV substrates.

Flexible, low friction, dry film lubricant weatherstip coating for aggressive seal movement such as folding car top seals.

Flexible, low friction, dry film lubricant weatherstip coating.  Deep black strength of finished parts.

Flexible, low friction, dry film lubricant weatherstip coating with high UV durability. 

Flexible, low friction, dry film lubricant weatherstip coating ideal for glassruns and door seals.

Flexible, low friction, dry film lubricant weatherstip coating.  Clear coating with faster cure speeds and effective internal UV resistance.

Flexible, low friction, dry film lubricant weatherstip coating.  Superior noise suppression and abrasion protection for dense seals.

Boosts tack on automatic inserters.

Good tack and machining on high speed machines.

Fast set and good adhesion for difficult papers. Open end - fast set.

Lowest viscosity resin/dextrin for stencil application.

For fast machine speeds and difficult to adhere substrates where a high tack, fast setting product is requirements

Neutral pH for x-ray and archival papers.

High viscosity, white in color.

High viscosity, blue in color.

Formulated Resin Emulsion Adhesive

In-line and off-line gumming.

Low viscosity gives good paper anchorage.

Water-based pressure sensitive adhesive

Water-based palletizing adhesive

General purpose assembly

Single ply corewinding, fast setting adhesive, excellent wet tack, good mechanical stability, dries clear

Designed for extrusion or wheel application.

A high wet tack, fast set speed, layflat

Superior, ready-for-use, laminating adhesive

General purpose assembly

General purpose assembly

General purpose assembly

General purpose window patch gum

Casing in resin

High solids, roll coatable laminating adhesive.

Good for laminating cardboard and other porous surfaces

Extended resin, improved machining for higher speed bag seam lines.

High adhesion, aggressive.

Formulated Synthetic Emulsion Adhesive

Transfer adhesive for bathroom tissue roller applications. Long open time and high tack with excellent dry release. Non-staining and water-soluble.

Adhesin, transfer adhesive for household toweling roller applications, long open time and high tack with excellent dry release, non-staining and water-soluble

3-sided pot. Better machining at high speeds, more expensive.

Dextrin-based product for spot seam for small bags. Low tack.

Urea formaldehyde cross-linker

Modified starch.

Resin additive.

Seaming.

4-sided pot. Bottoming on multi-wall bags improved performance over paste with resin addition.

Adhesion to poly, fast food bags. Poly handle attachment.

Superior adhesion at lower coating weights. Shear thinning product for grooved roller.

Cleaner, more stable 72-4172™, lower adhesion, non PSA.

Non-PSA, good Michelman.

Small bag film lamination, good adhesion, non PSA.

General purpose pressure sensitive acrylic.

Single and multi-ply tissue tail tie adhesive for spray, extrusion or squirt applications; high wet tack and water soluble; excellent release characteristics and storage stability (freeze/thaw stable)

Dextrin, best layflat.

Layflat laminating

Dextrin, high tack, fast setting, easy clean-up, contains nitrate.

Fast and aggressive; slightly faster setting than 32-1551™.

Neutral pH products. Contact TS for appropriate product.

General purpose and lowest cost. Higher tack, speed and retack versus 32-638B™.

Solid fiber lead product with extremely high tack, fast set speed, and good mileage.

High performance. More aggressive and improved adhesion.

Troubleshooter, fast setting, good tack, no polypropylene.

General purpose and low cost. High tack, slower speed vs. 33-9060™.

Extreme water resistance (passes 24-hour soak with 100% fiber tear).

Higher water resistance. Balance of high tack, fast set and good retack.

Resin, very fast setting, aggressive, can be metered down. 4000 and 7000 series

Good for hot and humid conditions

High tack for fast machines.

Good balance of tack and very good gumbox stability. One product for seam and window.

Lead recommendation for low adhesion windows.

Fast drying, good remoistening tack, low VOCs.

All extrusion systems.

33-349A™ without UV indicator.

Aggressive tack, fair gumbox stability.

PSA with added cleaning aid.

Troubleshooter. Improved adhesion to coated stock. Fastest set speed.

New Generation extrusion adhesive

Heat-resistant.

Best Adhesive and Troubleshooter.

Wet-out and good cleanup.

General purpose assembly

Laminating adhesive.

Water-based pressure sensitive adhesive

Water-based pressure sensitive adhesive

Water-based, pressure sensitive adhesive

UL-recognized component (MH28702) laminating adhesive.

Water-based, pressure sensitive adhesive

Provides a dry film coating which offers superior lubrication and excellent electrical capabilities

Water based instant adhesive designed for bonding exterior trim

Water based friction bonding adhesive.

Water based friction

Water based friction

Liquid additive for sulfuric acid anodizing baths that reduces time, energy consumption, and the amount of refrigeration required for a given anodizing process

Nickel-free cold seal for anodized aluminum

Used to produce a protective coating on aluminum and aluminum alloys.

Nonflammable, chromic acid based, coating chemical that will produce a chrome conversion coating on aluminum and its alloys.

The products are used as received to produce the protective coating on aluminum.

Ready-to-use liquid product that produces a chromate conversion coating on aluminum and its alloys.

Used to produce a protective coating on aluminum or aluminum alloys.

Produces a chromate conversion coating on aluminum and its alloys.

Conversion coating process for formed aluminum cans

Chromium-free zirconium/polymer product for treating aluminum to provide an excellent base for organic finishes and bonding.

Chromium free product formulated for treating non-ferrous alloys

Ready to use chrome free titanium polymer conversion coating for aluminum

Used to produce a chromate conversion coating on aluminum and its alloys

Formulated for the treatment of aluminum and its alloys.

Electroceramic coating for aluminum and titanium alloys

Trivalent chrome conversion coating approved to MIL-DTL-81706/MIL-DTL-5541F Class 1A and 3.

Used to build up the Alodine® T 5900™ bath

Concentrated liquid alkaline product developed to produce a fine satin etch on aluminum and its alloys

Temperature seal for anodized aluminum (low foam)

A conductive or resistive coating and impregnant

For heavy duty cleaning of ferrous metals prior to autodeposition

Environmentally friendly seal rinse technology

Alkaline cleaner designed to prepare steel surfaces to receive an Aquence coating

Used to remove a variety of soils, oils and forming lubricants from steel prior to the application of autodeposited coatings

For use in immersion process equipment for heavy duty cleaning and oxide removal from ferrous metal surfaces prior to autodeposition

Cleaner is a blend of inorganic acid components which remove rust and lights mill scale from ferrous substrates

For removing light rust and oxidation from iron and steel surfaces

Used to produce a smooth, black, water-based, organic coating on ferrous metal surfaces

Used to produce a black organic coating on ferrous metal surfaces

For demanding autodeposition applications like frames and chassis components

Seal rinse technology with enhanced chemical resistance

Anti-solder paste

Converts the metal surface to a non-metallic, iron phosphate coating that inhibits corrosion and increases the adhesion and durability of paint finishes

Designed for low temperature spray application to steel surfaces.

Iron phosphate process designed for multi-metal application.

Complex oxide pretreatment for hot dip galvanized or electrogalvanized

Chrome pretreatment for sheet and stripline applications

Zinc phosphate pretreatment is for sheet and stripline applications.

Formulated for dry-in-place, sheet or stripline application

Dry in place conversion coating for steel.

Conversion coating  process for cold forming

Polycrystalline zinc phosphate conversion coating designed for multi-metal immersion applications.

Conversion coating process for cold forming

Formulated for treating mixed production of steel, galvanized steel, aluminum and zinc alloy coated steel.

Water-based

Non-Hexavalent Chrome Passivate

Formulated for spray and immersion application to cold rolled steel, galvanized steel, electro-galvanized steel, zinc-alloy coated steels, and small amounts of aluminum.

Iron phosphate pre-treatment for sheet and strip line applications.

Polycrystalline conversion coating designed for multi-metal spray applications.

Converts the metal surface to a nonmetallic, polycrystalline coating

Chrome prepaint treatment for aluminum applications

Ambient, nanoceramic, phosphate free conversion coating formulated for use in multi-metal applications.

Second generation fluorozirconic nanoceramic for multisubstrate processes

Inhibits corrosion and increases the adhesion and durability of organic paints and finishes

A reactive metal forming lubricant

Liquid non-reactive polymer lubricant for cold forging

Water-based, pressure sensitive adhesive

A pickling process developed for stainless steel which removes the oxide layers formed during the rolling and the annealing of the metal

Low viscous, oil-based plunger lubricant

Air-drying graphite coating

Dry Film Graphite Lubricant

Multi-purpose solvent base graphite lubricant and resistive coating

Permanent mold coating

Boron Nitride Water Based Coating

Conductive, chemical-resistant coating

Low-viscosity emulsion

Primer coat for mold refractory and insulating coatings

Pressure die-casting release agent

Forging die lubricant

Forging die lubricant

Glass Coating for High Temperature Forging

Nitric acid based deoxidizer for aluminum

Deoxidine 172A is a spray phosphoric acid detergent-type metal cleaner and surface rust remover.

Phosphoric acid-based, detergent-type metal cleaner designed to remove rust and oxides left from laser cutting and welding on steel surfaces.

Acidic and specifically formulated for removal of scale from closed loop stainless steel heat transfer systems.

Deoxidine 457 is a non-flammable phosphate-free, surfactant-based cleaner, brightener and pre-paint conditioner for magnesium and aluminum.

Deoxidine 7150 is an acidic composition, which when diluted with water, produces a spray cleaning solution designed for removing light rust and oxidation from iron and steel surfaces.

Phosphorous-free, acid based metal pickle designed to remove rust and oxides left from laser cutting and welding on steel surfaces.

Chrome-free post treatment for conversion coated aluminum

Deoxylyte 54 NC Acidic, inorganic, liquid post treatment chemical used in immersion and spray final rinses to improve paint adhesion and to minimize under film corrosion and blistering.

General millwork, cross-linkable adhesive

General purpose assembly

Water-based, acid catalyst used to accelerate the crosslinking of specialty emulsion adhesives to create Type I and Type II bonds

Thick, elastomeric coating.

Water-based rubber emulsion

DORUS® CD 381 is a one part water based roll-coat-able or spray adhesive.

DORUS® CD 381Y is a one part water based roll-coat-able or spray adhesive.

Edge or face gluing cross-linkable adhesive

Aluminum chloride catalyst

Low viscosity edge glue product

Designed for use in solid wood edgebanding

Filled, high heat resistance, and very versatile.

Exceptionally long open time forming strong bonds, good heat-resistance.

High green strength, fast tack, excellent mileage, easy to spray, soft bond line, semi pressure sensitive.

High heat resistance PSA to bond flexible urethane foam to laminate floors.

Waterborne polyurethane dispersion

Waterborne polyurethane dispersion

Waterborne polyurethane dispersion

Solvent-free waterborne polyurethane dispersion

OH functional aliphatic water-based polyurethane dispersion for use in coating systems

Solvent free waterborne polyurethane dispersion for formulation of "greener" coatings

Dorus ND-4100 A high performance, heat reactivatable, one-component polyurethane adhesive for tough elastomeric bond applications.

Formulated polyvinyl emulsion adhesive

Water-based Vinyl Adhesive

Modified Resin Emulsion

Outstanding water-based, pressure sensitive adhesive

Exterior trim and PVC bonding

Nearly invisible bond line

Crosslinker

A flammable solvent based synthetic elastomeric adhesive for spray application involving a wide variety of porous and non-porous substrates.

EPI for edge gluing, NON-RF-curing.

Decabromodiphenyl oxide and antimony oxide in water.

Good adhesion to difficult substrates

Vinyl copolymer emulsion adhesive

Versatile woodbonding assembly adhesive

Versatile, crosslinking adhesive

Water-based wrapping adhesive

An AlCl catalyst

Dry film lubricant

Biostable bodymaker coolant for drawing and ironing of aluminum beverage cans

Bodymaker coolant/lubricant for drawing and ironing of tinplate food and beverage cans

Neat cupper lubricant for drawing and ironing of aluminum beverage cans

Cupper lubricant for drawing and ironing of aluminum beverage cans

Ultra low density expanded polymeric microsphere

Low density expanded microsphere

High performance expanded polymeric microsphere

Small particle size expanded polymeric microsphere

Low temperature expandable polymeric microsphere

Mid temperature expandable polymeric microsphere

Low temperature expandable polymeric microsphere (wet)

Acrylic-rubber hybrid solution pressure sensitive adhesive

E&C STYCAST 5952 A/B is a filled, thermally conductive silicone encapsulant.

Liquid concentrate used in a caustic etch baths to produce a consistent matte, fine grain etch on aluminum and its alloys

Eccobond UV9001 is a dual cure sealant and adhesive used in switch leads applications used in consumer and industrial markets.

Electrodag 440 AS is a nickel-based EMI shielding coating designed to give electromagnetic compatibility (EMC) used for electronic equipment.

Electrodag PF-021 is a UV curable encapsulanting photopolymer.

Electrodag SP-413 is a silver based EMI shielding coating

Emralon 329 is a fast-drying, resin bonded, fluorocarbon dry film lubricant capable of coating wood, metal, rubber, plastic, and glass substrates.

High performance fluoropolymer lubricant coating

Air dry water borne lubricant coating

Resin-bonded coating

Consumer packaging hot melt with ow viscosity; semi pressure sensitive hot melt for roll fed container labeling

Wrap around labeling

Consumer packaging hot melt, high performance, full pressure sensitve hot melt for container labeling

Consumer packaging hot melt, clear product that provides a wide operating range especially on cold wet CSD bottles.

Consumer packaging hot melt adhesive for bottle labeling

Consumer packaging hot melt, clear product that provides a wide operating range especially on cold wet bottles.

Medium viscosity hot melt pressure sensitive designed for permanent tape and label applications

Medium viscosity, repositionable, pressure sensitive hot melt adhesive for use on pre-applied labels

Long open time, general purpose hot melt

Powdered surface conditioning agent formulated to promote a fine, dense crystalline phosphate coating on iron and steel surfaces.

Fixodine Z-9 is a conditioning agent especially formulated to prepare iron, steel, aluminum, zinc and zinc-alloy surfaces for subsequent phosphate coating applications.

Liquid based surface conditioner designed to promote a refined crystalline structure when in a zinc phosphate coating application.

Water-based coating

Sacrificial mold release agent, water based, specifically formulated for use with resin/asbestos products

Sacrificial mold release agent offers a high gloss finish with excellent part detail and mold geometry retention

Non-CFC release agent designed to provide multiple releases with no contaminating transfer

Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins

Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins

Non-CFC, semi-permanent, multiple release polymer resin for fiberglass reinforced polyester (FRP) composites. Effectively releases all thermoset resins.

Non-CFC, semi-permanent, multiple release polymer resin designed to form a semi-permanent release interface on mold surfaces with application temperatures from room temperature to 135°C (275°F).

Proprietary water-based emulsion developed for releasing aerospace and other high performance composite structures

Sacrificial mold release agent, all-purpose, silicone based release agent

Water-based, semi-permanent release agent for releasing urethane elastomers.

Water-based release agent designed for rubber molding.

Water-based mold release agent designed for the more difficult molding applications and for silicone and rubber goods.

A water based release agent formulated for silicone and rubber goods and the most difficult to release molding applications such as EPDM and HNBR compounds

Water-based mold release agent for easy molding application of rubber goods

Water based mold release agent designed for rotational molding applications

Sealer for molds with microporosity problems, small surface scratches or imperfections

Unique water-based release agent with high temperature stability for thermoset composites

Frekote CS-122 is designed to form a thick, inert, thermally stable coating that is compatible with most solvent-based Frekote release agents.

Mold release designed to form a semi-permanent release coating on the mold surface for rigid, cast polyurethane products

A sacrificial mold release developed specifically for urethane elastomer systems

Sacrificial mold release agent offers superb release properties, choice of finish, and excellent part detail to meet your specific molding requirements

Solvent-based sealer specifically formulated for use on FRP, epoxy, or other composite mold surfaces

Semi-permanenant mold release agent specifically formulated for fiberglass reinforced polyester (FRP) gel coats

Formulated for use on molds with temperatures above 60°C (140°F)

Sacrificial mold release agent offers a high gloss finish with excellent part detail and mold geometry retention

Non-CFC, semi-permanent, multiple release polymer resin for rigid, cast polyurethane products

Sacrificial mold release agent specifically formulated for use as a release interface for RIM and R/RIM polyurethane processes.

A unique polymer release agent designed for all gel-coat fiberglass reinforced and filled polyester composites

Unique low VOC polymer release agent that quickly cures and provides for multiple releases of all polyester resins.

Solvent-based polymer release agent for fiberglass reinforced polyester (FRP) composites with a unique high slip formulation that cures quickly and provides multiple releases for low VOC polyester gel-coat and other tough releasing polyester structures

Non-chrome acrylic for long term passivation of galvanized and galvalume substrates

Premium, synthetic based, lithium thickened grease

One-part infusion resin for VARTM processing. Moderate viscosity, very high toughness with good hot wet properties.

HYSOL 190024LV single component, UV curable adhesive.

Encapsulant-Fill

HYSOL 3508NH is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components.

Nitrile / phenolic, water based primer

High performance encapsulant

Dispensible, fast cure, general conductive, Pb-free paste adhesive alternative to solder.

Die edge coating on flip chips.

One part, low temperature fusing epoxy powder for all types of capacitors including film, ceramic and tantalum.

Electronic coating powder used on all capacitor types, thermistors and resistors.

Environmentally friendly coating powder used on passive components including all capacitor types.

Hysol DK42 is used on passive components including all capacitor types.

HYSOL DS6000 is a one component adhesive sealant designed for display assembly applications. It exhibits high compatibility with liquid crystal materials.

Hysol E-3239 is an adhesive encapsulant used in ink jet applications and other MEMS devices

An innovative nonreworkable, capillary flow underfill.

HYSOL E1216M capillary flow underfill is designed for high volume assembly operations requiring a very fast flowing underfill that cures in a a single reflow cycle. It is used in CSP, BGA and Flip Chip BGA applications. It is specifically formulated to eliminate anhydride-type curing agents for those who prefer to work with anhydride-free products.

RTM resin, 250°F/121°C service, epoxy, two component

Adhesive primer, solvent based, high temperature, 350°F/177°F curing, chromated

Toughened paste, high peel, two component, ambient cure, 180°F/82°C service

Toughened paste, high peel, two component, ambient cure, 180°F/82°C service

Filled paste, 250°F/121°C service temperature, ambient cure

Toughened paste, thixotropic, 180°F/82°C service

Filled paste, 300°F/149C service temperature, ambient cure

Toughened paste, high peel strength, volumetric mix ratio, 200°F/93°C service temperature

Toughened paste, high elongation, 140°F/60°C service temperature

Toughened paste 250°F/121°C service temperature, structural

Low viscosity resin, composite repair, laminating, 350°F/177°C service temperature

Filled paste adhesive, thixotropic, liquid shim, 350°F/177°F service temperature, low peel

Filled paste, liquid shim, fast cure, 225°F/107°C service temperature

Low viscosity resin, 350°F/177°C service temperature, composite repair resin, room temperature cure

Syntactic low density paste, 300°F/149°F service, room temperature cure, lightweight

Metal bond film adhesive, 250°F/121°C service temperature

Metal bond film adhesive, 250°F/121°C service temperature

Film adhesive, 400°F/204°F service temperature

Bismalimide film adhesive, 550°F/288°C service temperature

Film adhesive, 250°F/121°C cure, 300°F/149°C service temperature

Film adhesive, composite bonding, 300°F/149°C service temperature

Paste adhesive, one part, elevated cure, expanding, 250°F/121°C service temperature

Low-density, one-component epoxy syntactic used on honeycomb composite parts requiring high compressive strength at temperatures up to 350°F (177°C).

Peel ply, pre-impregnated, polyester scrim

A two component, heat cure, epoxy paste adhesive with outstanding physical and dielectric properties and service temperatures up to 230°C.

HYSOL ECCOBOND 2332-17 is a solventless one component epoxy adhesive that develops high bond strength when cured at temperatures as low as 100 to 130°C.

HYSOL ECCOBOND 281 is a one component filled thixotropic paste,

A highly filled, thermally conductive, thixotropic epoxy paste with low CTE.

Electrically conductive paste adhesive.

Two component, flexible, low temperature cure paste adhesive.

HYSOL ECCOBOND 927-10 epoxy adhesive for medical applications.

One component, flexible, fast cure

Good thermal conductivity; good high temperature resistance paste adhesive - bonds well to metal, glass, plastics and ceramics.

A general conductive, low viscosity version of C850-6.

One-component, general conductive, silver-filled epoxy paste adhesive.

Dispensible, low temperature, snap cure paste adhesive.

Heat cure, tin and tin lead compatible, paste adhesive

Electrically conductive, tin and tin lead compatible, paste adhesive with superior contact resistance stability. Viscosity optimized for screen- and/or stencil-printing.

Electrically conductive paste adhesive.

One component, flexible, nickel-filled paste adhesive

Electrically conductive paste adhesive.

HYSOL ECCOBOND CT4042-1 A/B is a two component silver-filled, easy to apply, conductive epoxy paste adhesive. It is recommended for chip bonding in microelectronics applications. It is a lower viscosity version of ECCOBOND CT4042 adhesive.

Surface mount adhesive designed for high speed dispensing.

HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications.

Dielectric paste adhesive

Flexible, low temperature, fast cure.

HYSOL ECCOBOND E3526 is specially developed for ferrite core bonding applications.

A one component, low temperature cure, surface mount adhesive that can be applied easily without stringing.

HYSOL ECCOBOND G500 is a general purpose epoxy adhesive and sealant that cures to a high gloss finish.

Electrically non-conductive flexible paste adhesive.

One component snap curable electrically conductive paste adhesive.

One component, low temperature heat cure thermally conductive epoxy paste adhesive.

Designed as a faster curing, high thixotropic adhesive that gives good flow control and adhesion for a thick bondline.

Silver-filled epoxy coating.

HYSOL ECCOCOAT C910-3 epoxy based, nickel plateable termination coating is recommended for use in the assembly of passive components.

HYSOL ECCOCOAT CT5030 Catalyst B97 is a conductive ink designed to provide thin coating used in shielding and grounding applications.

HYSOL ECCOCOAT PC355-1FL flexible thermoplastic varnish is formulated to protect and insulate printed wiring boards both on the component and the soldered side.

One component polyurethane

HYSOL ECCOSEAL 7100 adhesive sealant is designed for high throughput display assembly that require protection against humidity and oxygen.

Encapsulant-potting two component, heat cure, epoxy adhesive.

Two component, room temperature cure, encapsulants potting epoxy.

Hysol EO1016 is a UL94V-0 encapsulant for Smartcards and watch IC's. Nonabrasive filler allows for grinding if necessary.

Hysol EO1058 is a single component epoxy system that cures at 125°C and provides excellent environmental and thermal protection to encapsulated parts.

Hysol EO1061 is a medium glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.

Hysol EO1072 is a one component, general purpose, high performance epoxy encapsulant with high Tg and low extractable ionics.

Hysol EO1086 is a one-component epoxy encapsulant.

HYSOL EO7021 encapsulant for use in smart card chip module applications.

Hysol EO7038 is a one-component epoxy potting compound, formulated to protect sensors used in harsh environments, such as automotive applications

Hysol EO8007 (formerly Loctite 99700) is a unique 100% reactive, 100% solids epoxy insulating resin.

Undiluted epoxy 100% solids system, should be used where very low mixed viscosity is not a critical requirement.

Hysol ES0617 is a filled system offering improved thermal conductivity and increased resistance to heat and thermal shock.

Black, low cost, flexible, capable of UL94HB, resistant to thermal shock, non-abrasive filled, high impact strength, long pot life

Hysol ES1004 is capable of UL94V-0, stable to 155°C.

Clear, low shrinkage, excellent chemical resistance, strong bond to substrates

Hysol ES1902 is a clear, room temperature cure, transparent, very fast UV gel, excellent dimensional stability and low viscosity; easy to handle.

High heat distortion temperature, low expansion, dimensionally stable

Hysol ES4512HF is a two-part non-conductive potting compound. It is used in the consumer & Industrial market.

Hysol FF2300 is a no-flow underfill for eutectic and lead-free applications.

Low stress fill for potting automated sensor and diodes; high Tg.

Hysol FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications.

Hysol FP0087 is low stress fill for potting automated sensor and diodes, high Tg.

Hysol FP4450HF is a high flow version of FP4450LV using synthetic filler for use in fine wire and low alpha fills applications.

Hysol FP4451 is an industry standard damming material for BGAs.

Hysol FP4460 is a general purpose, high purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products.

HYSOL FP4502 is a flip chip underfill.

Hysol FP4530 is snap cure flip chip underfill for FC on flex. Designed for gap size down to 25 microns.

Hysol FP4545FC is a low viscosity version of FP4548FC

Hysol FP4549 is used for fine-pitch flip chip applications, fast flowing, low stress underfill.

Hysol FP4581 is used on lead-free flip chip packages (L3 - 260°C); low-k/Cu flip chip packages with Hi-Pb bumps, flux compatible.

Capillary underfill

Hysol FP4652 is a fast cure, low stress version of FP4450 for a large array of packages.

HYSOL FP4655 is a high performance encapsulant which can be used alone or as a cavity fill material, or in combination with FP4451 material as part of a dam and fill system. Its low viscosity and fine particle filler size make it ideal for devices with fine pitch wire spacing.

Hysol FP5001 is one part with excellent thermal cycling resistance, laminate packages (CSP, SCSP, SIP). Compatible with both constant and pulse heat tools. Recommended for gold / gold assembly joint.

NCP for thermal compression bonding

NCP for thermal compression bonding

Hysol FP6401 is a high purity, liquid flexible damming material.

Hysol GR15F-1 is a green anhydride cured molding compound that contains spherical filler and is designed for high voltage applications. This product has excellent moldability performance with high yield rates.

HYSOL GR15F-A anhydride cured molding compound is formulated to contain spherical fillers.

Hysol GR2310 is a gold, non-halogenated molding powder, for tantalum and ceramic capacitors, leaded or surface-mounted sensors.

Black/non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors

Molding compound

Molding compound

Hysol GR2811 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements to 260°C reflow temperature. GR2811™ meets UL 94 V-0 Flammability at 6.35mm thickness.

Hysol GR360A is a green, high-productivity molding compound designed for use in high voltage power applications requiring good electrical stability at high temperature.

HYSOL GR360A-ST-1 is an environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant. It meets UL 94 V-0 flammability at 6.35 mm.

Molding compound

Green molding compound designed for power SO and surface mount discrete packages (High Power Packages, Power SOIC, Power SSOP).

High thermal conductivity-isolated packages, green, designed to improve thermal management for semiconductor devices.

Hysol GR750HT-25 is a high thermal conductivity molding compound using fully alumina fillers designed to improve thermal management for semiconductor devices.

Ultra low stress, high adhesion molding compound

HYSOL GR828FC1 is an environmentally friendly "green" molding compound containing no bromine, antimony or phosphorus flame retardant.

Molding compound. Surface mount/leadframes (QFP, T/LQFP, TSOP, SOIC)

Technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of laminate based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled

Technologically advanced epoxy molding compound designed for use as an overmold on a wide variety of BGA and CSP.

State-of-the-art epoxy molding compound developed to meet the encapsulation requirements of memory card (MMC) devices.

High adhesion, ultra low stress, green mold compound suitable for BGA and contains no bromine, antimony or phosphorus flame retardant.

Hysol HuaweiKLG750 has superior adhesion technology to ensure zero delamination performance for SOT and SOIC packages.

Low thermal expansion and low stress molding compound suitable for GBU,KBU,TO,ZIP,SIP,DIP and SDIP packages, providing superior moldability and reliability.

Low stress and high reliability molding compound suitable for TO, SOIC ,SSOP and QFP packages, providing high purity and low uranium content. It’s low viscosity properties enables low wire sweep molding with a large operating window.

Hysol KL-4500-1NT is a low stress and high reliability molding compound suitable for SOIC packages.

Hysol KL-6500S is a low stress molding compound suitable for SOT/SMX and SOD packages.

Hysol KL-G100 is a green mold compound with 1/4" flammability rating suitable for bridge, axial and TO packages.

Molding compound

Molding compound. Surface mount/leadframes

Molding compound. Surface mount/leadframes (SOT/SMX).

HYSOL KL-G730 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol KL-G730 offers enhanced reliability peformance for T/LQFP packages. KL-G730 meets UL 94 V-0 flammability at 3.175mm thickness.

HYSOL KL-G800H CD is a green epoxy molding compound suitable for thin leaded packages. It is designed to achieve JEDEC level 2. It is used in SOT and SMX applications.

Molding compound

KL1000-4TX(NT) epoxy molding compound delivers outstanding performance and ease of use.

HYSOL LA3032-78 encapsulant is designed for high throughput assembly operations.

Epoxy core splice, 350°F/177°C service temperature

Epoxy core splice film, fire retardant, 350°F/177°C service temperature

Hysol MG15F-0140 is a anhydride cured molding compound designed specifically for use in high voltage power applications requiring good electrical stability at high temperature.

Hysol MG15F-35A is a anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperatures.

Hysol MG17-0604F is a white epoxy molding compound specifically formulated for use as an overmold for opto coupler devices.

Hysol MG21F-02 is an ECN base molding compound suitable for medium voltage.

Hysol MG33F-0588 is a specially formulated product designed for use in high volume molding of tantalum capacitors.

Hysol MG40FSBlack / conventional molding of SMD and SIP networks; gold version MG40F-0526 available

HYSOL MG40FS-AM epoxy molding compound delivers outstanding performance and ease of use. It is used in PDIP, SOIC and power discrete applications.

HYSOL MG52F-99B NXP high productivity modling compound, designed for high volume encapsulation of surface mount devices.

Hysol OS1600 is a water white casting system suitable for use on visible and I.R. L.E.D.

Hysol OS4210 is a low viscosity, long pot life 2.3.5.2.11.4 system that cures at 85°C or above to yield clear water white castings.

Hysol PC12-007M is a 100% solids, general purpose, epoxy printed circuit coating developed to meet military requirements.

Hysol PC20M is a stable, clear material suitable for continuous operation up to 110°C.

Thin film printed circuit board coating with good toughness and high flexibility

Hysol PC30STD is a waterborne acrylic, one component coating recommended for printed board coating.

HYSOL PC40-UMF conformal coating is specifically formulated to rapidly gel and immobolise when exposed to UV light and then fully cure when exposed to atmospheric moisture, ensuring optimum performance even in shadowed areas.

Hysol PC54 is a rapid drying, one-component for acrylic non-atomized spray coating applications. Provides excellent vibration resistance and toughness. Can be removed for repair.

Epoxy foaming paste, expanding, 350°F/177°C service temperature

Epoxy core splice film, expanding, 350°F/177°C service temperature

Composite bond film adhesive, 300°F/149°C service temperature

Film adhesive, 300°F/149°C service, non-metallic filled

Film adhesive, high temperature 350°F/177°C service temperature, non-metallic filled

Film adhesive, composite bonding, 300°F/149°C service temperature

Composite surfacing film, epoxy

Hysol QMI 301 is a silver filled, conductive cyanate ester adhesive for attachment specifically designed for high throughput attachment of integrated circuits to cofired ceramic packages.

Hysol QMI 536UV is used for component or die attach where very high electrical and thermal conductivity is required. Suitable for high heat dissipation devices and solder replacement applications.

Hysol QMI505MT is a lower stress BMI based paste for preplated, alloy 42 and black oxide finishes.

Hysol QMI516 is a conductive paste for PBGA and SBGA packages.

Hysol QMI516LC is a low temperature cure, general conductive, silver-filled paste adhesive.

QMI519 is a silver filled conductive adhesive for attachment of integrated circuits and components to metal leadframes advanced substrates.

General conductive, die attach adhesive

Die attach adhesive

Hysol QMI536NB has high JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.

Hysol QMI536NB-1A5 is a non-conductive die attach paste.

Non-conductive paste for leadframe applications. Very low stress QMI538NB°1A2, 1A3, 1A4 for die sizes greater than 500 x 500 mil. / 13 x 13 mm.

Hysol QMI547 is a non-conductive paste for leadframe applications.

Innovative high mechanical reliability and reworkable edgebond, thermal cure material designed for CSP and BGA devices.

Stycast 1090SI is a room temperature cure lightweight syntactic encapsulant that is recommended for applications where high compressive stress is applied to encapsulated circuitry - as in deep ocean work..

Encapsulant-potting

HYSOL STYCAST 2651-40 is a filled, general purpose, dielectric grade epoxy encapsulant. It is a lower viscosity version of STYCAST 2651. It has excellent adhesion to a wide variety of substrates and excellent electrical properties. It can cured with CATALYST 11, CATALYST 9 and CATALYST 23 LV.

HYSOL STYCAST 2651-40FR Catalyst 24LV encapsulant is designed for general potting applications.

HYSOL STYCAST 2651MM is designed as a general purpose encapsulant which requires low viscosity and low abrasion. It is especially useful for machine dispensing and for parts that require post molding machining.

HYSOL STYCAST 2651MM Catalyst 9 is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining.

HYSOL STYCAST 2762 Catalyst 14 encapsulant

Heat cure encapsulant-potting.

HYSOL STYCAST 2850KT CATALYST 24LV is a thermally conductive, electrically insulatiive epoxy encapsulant designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high voltage applications where surface arcing or tracking is a concern.

HYSOL STYCAST 2850MT-Catalyst 24LV is a two component, electrically insulating general purpose encapsulant. It

HYSOL STYCAST 2850MT-Catalyst 9 is recommended for encapsulation of components that require heat dissipation and thermal shock properties.

HYSOL STYCAST 3050 Catalyst 9 is desgined for potting and encapsulation applications with very small physical spacing between parts.

For protection of wire bonds consider this high purity material as either a dam or a glob top.

HYSOL STYCAST E1070 epoxy encapsulant

Stycast E2534FR/Catalyst 9 is a heat cure epoxy potting compound that complies with recent demands on environmentally friendly products and does not contain brominated flame retardants.

Stycast NX-17 is a two-component, heat cure, epoxy encapsulant with good adhesion to PPA.

Thermally conductive, high temperature silicone thermal grease.

Encapsulant

Syntactic epoxy film, prepreg substitution ply, 250°F/121°C service temperature.

High crush strength, low density syntactic core material, co-curable with a variety of 350°F / 177°C curing epoxy prepregs.

Epoxy expanding syntactic film for low density applications

An expanding syntactic film, which cures at 300°F / 149°C, used for jet engine abradable fan seals.

Epoxy expanding film for jet engine abradable seal

HYSOL TRA-BOND 2106 two component epoxy is designed for high strength structural bonding applications.

Tra-Bond 2115 is an excellent choice for bonding optical where alignment accuracy is essential.

Thixotropic two part, room temperature cure, paste adhesive.

This two-part, low viscosity epoxy paste adhesive is designed for use on fiber optic assembly applications.

Optically clear, low viscosity, room temperature cure, epoxy adhesive.

Tra-Bond F253 is a two-part epoxy formulated to change color during the cure process to indicate the cure status.

A room temperature cure, thixotropic epoxy adhesive designed for medical device applications.

Tra-Cast FS245 is a thixotropic, two-part adhesive used on staking transistors, diodes, resistors and printed circuit electronics applications.

Two part epoxy

Hysol UF3537 is a fast cure underfill used on chip scale packaging.

HYSOL UF3808 is a capillary underfill designed to cure quickly at low temperatures to minimize stress to other components.

Hysol UF8830 is a liquid epoxy underfill for flip chip BGA.

Low VOC, Flame Retardant, Thixotropic (1.0), Approvable UL 94V-1 / UL 900

Encapsulant potting urethane.

HYSOL US1151 is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a bed of 8-12 mesh sand increases thermal conductivity while decreasing shrinkage and cost. HYSOL® US1151™ can be used to encapsulate electronics for various applications including under-the-hood automotive and marine. The low glass transition temperature means that sensitive compounds are not damaged during low temperature excursions.

HYSOL US1750 elastomeric polyurethane, is a waterwhite, clear, medical grade, fast gel potting material. It is ideal for blood heat exchanger, dialyzer and oxygenerator units.

Hysol US2350 is a flexible, flame retardant, mineral filled, polyurethane compound.

Hysol US2651 is an unfilled, low viscosity, re-enterable potting and encapsulation compound.

Hysol US5511 is a flexible, flame retardant, mineral filled castor oil/MDI based polyurethane compound.

Encapsulant potting urethane.

Hysol US5544 is a fast gelling, flexible, flame-retardant, mineral-filled polyurethane compound.

HYSOL UV3000LH UV cure adhesive is designed for high throughput assembly operations. A low halide version of UV3000. It is used in CMOS glass bonding.

Encapsulant-fill material

Hysol XA80215-1 is a one component, non-conductive photocurable adhesive designed for high throughput assembly operations. This material is suitable for use with temperature sensitive substrates and components.

HYSOL XCE3120 anisotropic epoxy adhesive is designed for high throughput microelectronics assembly applications.

Reworkable, snap cure, void-free, fast flowing underfill that also provides excellent adhesion and reliability benefits.

HYSOL XUV9086 is a one component UV cure encapsulant used in ink jet applications.

HYSOL XUV80260 is a UV curable display perimeter sealant for rigid type OLED.

ABLESTIK ICP-4000 is a silicone based, electronically conductive adhesive recommended in mounting small components to a variety of interconnect substrates.

High performance, synthetic, long-lasting

Excellent lubrication properties over a broad temperature range

High gloss, high rub, sheet in-line

Gloss, sheet in-line

Standard waterbased low seal temperature heat seal coating for medical/food applications

Standard In-line water-base PUR

Curative for LA7773-21

Laminating adhesive

Two component solventless adhesive for medium to high performance.

One component solventless adhesives for paper lamination.

Two component solventless adhesive for low to medium performance applications.

Two component aliphatic solvent based retort laminating adhesive.

Curative for UR2790-22

General purpose, ultra clear epoxy paste and multiple surface structural adhesive

Bonding expanded polystyrene, polyethelene, and urethane foams

Formulated for spray applications

Provides structural strength and flexible potting characteristic

High temperature and chemical resistant, gap filling high viscosity epoxy paste and multiple surface structural adhesive

Medium to fast setting, hot melt adhesive

High strength preapplied threadlocker with temperature performance up to 400ºF.

Low to medium strength, preapplied threadlocker designed for brass.

Medium strength threadlocker gel, no run formula.

High strength, preapplied threadlocker designed for plated fasteners and with temperature performance up to 400ºF.

For fasteners over 7/8" in diameter. High lubricity allows proper clamp load to be achieved. Heat required to remove.

Medium to high strength, preapplied threadlocker with own microcaps.

Low strength removable purple threadlocker for small fasteners under ¼”.

Medium strength retaining compound for heavy interferences and high torque

General purpose MIL-SPEC medium strength blue threadlocker for ¼” to ¾” bolts. Disassemble with hand tools.

TOP PICK Primerless, Oil Tolerant, surface insensitive medium strength blue threadlocker designed for the locking and sealing of threaded fasteners between 1/4" and 3/4" (6 to 20 mm). Disassemble with hand tools.

Up to 450°F, Medium strength, surface insensitive threadlocker for heavy duty applications. Disassemble with hand tools.

Activator for anaerobics

Up to 650* F High temperature, high strength threadlocker. Heat required to remove.

High strength, surface insensitive, high temperature threadlocker.

High strength red threadlocker formulated to enhance health and safety.

Up to 450°F high temperature, high strength, fast curing threadlocker. Heat required to remove.

High strength red threadlocker for large bolts > 7/8”. Heat required to remove.

Medium - high strength, high temperature, wicking grade threadlocker for pre-assembled parts.

An acrylic, general purpose structural adhesive, designed to bond untreated low energy substrates such as polypropylene

Adhesive designed to bond e-coated metals to glass fiber filled polypropylenes.

Loctite 3051 is designed for bonding cannulae into hubs, syringes and lancets.

Fast curing cyanoacrylate adhesive for bonding a variety of plastics, rubber and porous materials.

Acrylic, low modulus, high viscosity, UV/V light cure adhesive.

Acrylic, high strength, low viscosity, UV/V light cure adhesive.

An acrylic, high strength, medium viscosity, thixotropic UV/V light cure adhesive.

Acrylic, low durometer, rubbery, UV cure adhesive.

Loctite 3119™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates.

Loctite 3128 is an edgebond, thermal cure, black image sensor adhesive.

Photonics material

Epoxy resin, part of a two part system to be used with a hardener, formulated for high temperature potting and encapsulating

Epoxy resin, part of a two part system to be used with a hardener, formulated for flame retardant potting and encapsulating

Epoxy hardener, part of a two part system to be used with a resin, formulated for glossy surface finish potting and encapsulating

Epoxy hardener, part of a two part system to be used with a resin, formulated for fast cure potting and encapsulating

Epoxy hardener, part of a two part system to be used with a resin, formulated for low shrinkage potting and encapsulating

Polyurethane hardener, part of a two part system to be used with a resin, formulated for gast curing potting and encapsulating

Polyurethane hardener, part of a two part system to be used with a resin, formulated for flame retardant potting and encapsulating

Loctite® Liquid Optically Clear Adhesives (LOCAs) acrylic

Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) acrylic

High viscosity, flexible, UV/V, light cure adhesive.

Photonics material

LOCTITE 3220WH is a one component designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. 3220WH is the white colored version of Loctite 3220 adhesive.

Two-step acrylic, no-mix, high temperature, solvent resistant, gap filling adhesive

Low tin, anaerobic structural adhesive

Low viscosity, slightly flexible, UV/V light cure adhesive.

Low viscosity, slightly flexible, UV/V light cure adhesive.

Two-step acrylic, no-mix, high temperature, high viscosity, multiple surface structural adhesive

LOCTITE 3323UV has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Loctite UV fill encapsulants, such as 3327 and 3329. Either combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55 °C to +125 °C and humidity heat aging 85 °C / 85 % RH.

Rigid, one-part, high temperature resistance, excellent surface cure, low shrinkage, and low outgassing

Semi-rigid, general purpose, one-part, medium viscosity epoxy with excellent surface cure, low shrinkage, low outgassing

Semi-rigid, chemically resistant, one-part, medium viscosity epoxy with excellent surface cure, low shrinkage, low outgassing

Medium viscosity, UV light cure adhesive

A two-component urethane designed for flame resistance and fast cure

One part, heat cure silicone

Acrylic, medium viscosity, UV light cure adhesive.

Acrylic, high viscosity, UV light cure adhesive.

White, color-matched seam sealant

Loctite 3508 is a lead-free, one-component epoxy cornerbond adhesive. Applied pre-reflow and allows self-alignment of SMT components during reflow operation. Used for lead-free applications.

Loctite 3513 is a reworkable, single-component epoxy used as a underfill for CSP or BGA's.

Loctite 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP (FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.

Used to bond, seal or coat metal and glass components in industrial applications

UV/V/Heat cure version of Loctite® 3525

Loctite 3548 is a next generation reworkable underfill for thermal and mechanical reliability.

Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.

High viscosity, fluorescing, visible light cure adhesive.

Acrylic, medium viscosity, fluorescing, visible light cure adhesive.

Rapid curing, fast flowing, reworkable, liquid epoxy for use as a capillary flow underfill for packaged IC's

Loctite 3609 is used for medium to high speed dispense applications. Excellent green strength for large components.

LOCTITE 3612 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering.

Loctite 3619 is used for ultra low temperature cure, high speed syringe dispense.

Loctite 3627 is a high speed stencil print adhesive compatible with DEK Proflow and MPM Rheopump. Recommended product for DEK Proflow Pumprint process.

LOCTITE 3629C is a one-component, halogen free, fast cure epoxy formulated for bonding surface mounted devices to printed circuit boards prior to wave soldering.

Toughened, high strength moisture cure, hot melt adhesive

Acrylic, medium viscosity, UV light cure adhesive.

Loctite 3705 is an edgebond, UV cure adhesive designed for bonding electronics components on PCBs.

ITO/COG overcoat

UV acrylic adhesive.

UV acrylic adhesive.

UV acrylic adhesive.

UV acrylic adhesive. (LPD181)

Low viscosity instant adhesive, black, rubber toughened.

LOCTITE 383 Output is a high-strength, room temperature cure adhesive for permanent assemblies.

UV structural adhesive

Loctite 3861 is a low viscosity versatile epoxy casting system that exhibits high thermal conductivity and low thermal expansion.

Loctite 3873 is a fast curing, high-conductivity, self-shimming, room temperature cure, paste adhesive for bonding heat-generated devices to thermal spreader.

Loctite 3875 is the highest conductivity room temperature cure system.

Loctite 3880 is a general conductive paste adhesive designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required.

Loctite 3900 is an air-dry acrylic coating designed for small production runs.

Medium viscosity, UV/V light cure adhesive.

One-part, dual-cure, toughened, high viscosity, magnet bonding adhesive

Low viscosity, fluorescing, UV/V light curing adhesive with sterilization resistance.

AssureCure light cure adhesive can be provided in a range of viscosities, physical properties and package configurations.

Medium viscosity, thixotropic, fluorescing, UV/V light curing adhesive with sterilization resistance.

Low viscosity, fluorescing, UV/V light curing adhesive with sterilization resistance.

High viscosity, fluorescing, UV/V light curing adhesive with sterilization resistance.

Conformal coating.

Medium viscosity, UV/V light curing adhesive, fluorescing.

Acrylic, rapid-curing, UV/visible, non-sag gel

One-part, heat cure, toughened, highly flourescent, medium viscosity epoxy

One-part, heat-cure, toughened, non-sag, high viscosity, motor armature bonding epoxy, multiple surface structural adhesive

Low viscosity instant adhesive, surface insensitive, one part, room temperature cure.

Very low viscosity instant adhesive, one-part room temperature cure.

Very low viscosity instant adhesive, low odor / low bloom, surface insensitive.

Highly flexible, 60-second open time EVA hot melt

Wicking grade, surface insensitive, one part, room temperature cure, low viscosity instant adhesive.

Very low viscosity instant adhesive, low odor / low bloom, one part room temperature cure.

High viscosity instant adhesive, black, rubber toughened, one part, room temperature cure.

Designed for temporary bonding applications

General purpose adhesive particularly suited to bonding of metal substrates.

High viscosity instant adhesive, one-part room temperature cure.

General purpose, low viscosity instant adhesive, wicking type plastic bonder.

High viscosity instant adhesive, toughened, thermally resistant.

Instant adhesive for medical device use.

Threadlocker for small metal and plastic fasteners and tamper-proofing, up to 180°F.

General purpose adhesive and is particularly suited to bonding of metal substrates.

Low viscosity instant adhesive, one part, UV/V light fast curing cyanoacrylate.

High viscosity instant adhesive, gap filling, surface insensitive, one part, fast curing cyanoacrylate.

Fast curing cyanoacrylate, toughened, high viscosity, designed for bonding applications that required a toughened product, very rapid fixturing, fillet cure or surface cure.

Low viscosity instant adhesive, black, surface insensitive, rubber toughened, one part, room temperature cure.

High viscosity instant adhesive, one part, surface insensitive, room temperature cure.

High viscosity instant adhesive, low odor / low bloom, suitable for porous surfaces and vertical or overhead applications.

Low viscosity instant adhesive, low odor / low bloom, one part room temperature cure, designed for applications with high cosmetic appearance and/or where vapor control is difficult.

Medium viscosity, flexible instant adhesive

Particularly suited to bonding of metal substrates.

General purpose adhesive and is particularly suited to bonding of metal substrates.

Medium viscosity, thermal cycling, one-part, room temperature cure, instant adhesive.

Clear, two-component epoxy

A low viscosity, non-toxic, water-based, preapplied thread sealant

One part, UV or visible light curing, high speed silicone potting compound

Provides the properties of 5039™ while offering improved humidity / moisture resistance.

A high viscosity, non-toxic, water-based, preapplied thread sealant

Used for potting, coating and sealing of various automotive, military and industrial components.

Self-leveling, flowable silicone adhesive sealant

One part, dual cure; UV/moisture, acetoxy silicone; thixotropic paste for gasketing, sealing, and bonding

Used for gasketing and sealing applications

One part, dual cure; UV/moisture, acetoxy silicone; low viscosity for potting and encapsulating applications

Electrical grade anaerobic sealant

Low viscosity, high temperature (350ºF), preapplied thread sealant for metal and plastics

Used for potting, coating and sealing of various automotive, electronic, military and industrial components.

Flexible flange sealant for use on rigid machined flanges - Top Pick

A low viscosity, non-toxic, water-based, preapplied thread sealant

Flexible, solvent resistant flange sealant that will not tear or decay.

Loctite® Liquid Optically Clear Adhesives (LOCAs) (with chemistry) silicone

Seals close fitting joints between rigid metal faces and flanges

Self leveling, non-corrosive, UV/moisture silicone with high adhesion for difficult-to-bond substrates

An acrylic cured-in-place gasket that cures 100% by UV light.

Loctite 5293 is a repairable, solvent-free, medium viscosity, UV / moisture cure silicone suited to brush, dip and selective coating.

Loctite 5404 Output is a self-shimming, heat cure, flexible silicone adhesive paste for demanding parts such as ceramic boards.

Recommended for sealing the fine threads of hydraulic and pneumatic connectors.

Specially formulated to offer high lubricity for easy assembly and removal - Top Pick

Fast cure thread sealant designed for hydraulic / pneumatic fittings - Top Pick

Elastomeric adhesive/sealant based on Henkel's proprietary Flextec technology, black color

Elastomeric adhesive/sealant based on Henkel's proprietary Flextec technology, grey color

One part humidity moisture curing elastic adhesive / sealant, silane modified polymer based on Flextec™ Technology.

Elastomeric adhesive based on Henkel's proprietary Flextec technology

A two-component adhesive for elastic bonding where the curing rate of one-component adhesives is too slow, based on Flextec™ Technology

Heavy bodied, high strength adhesive & sealant with 10-minute fixture time

Two-part, non-corrosive silicone adhesive & sealant, 10-minute fixture time

Self Leveling, NonCorrosive, Flame Retardant Silicone Potting Compound

A 2-part static-mixable, self-leveling silicone sealant.

Two-part, ultra-clear silicone, 30-minute cure speed

Ultra-clear, soft re-enterable gel silicone potting compound

General purpose instant sealer for metal tapered and straight/tapered pipe thread fittings - Top Pick

High strength hydraulic sealant.