Full Product List
| 22-0092UV™ | Packaging dextrin layflat, non-warping, non-blistering |
| 24-6071T™ | General purpose seal gum |
| 25-0064UV™ | General purpose stencil applied back gum |
| A-602B™ | Thermosetting, synthetic resin-based adhesive shoe dip formulation |
| Acheson® 8370APA™ | Low gloss dry film lubricant weatherstip coating. |
| Acheson® 8370A™ | Flexible, low friction, dry film lubricant weatherstip coating. For high abrasion and noise resistance requirements. |
| Acheson® TW-005A™ | Flexible, low friction, dry film lubricant weatherstip coating for applications hotter than 120˚C. |
| Acheson® TW-017B™ | Flexible, low friction, dry film lubricant weatherstip coating for use on colored EPDM and TPV substrates. |
| Acheson® TW-020™ | Flexible, low friction, dry film lubricant weatherstip coating for TPV substrates. |
| Acheson® TW-023HS™ | Flexible, low friction, dry film lubricant weatherstip coating for aggressive seal movement such as folding car top seals. |
| Acheson® TW-040™ | Flexible, low friction, dry film lubricant weatherstip coating for both sponge and dense seal applications. |
| Acheson® TW-044™ | Flexible, low friction, dry film lubricant weatherstip coating. Deep black strength of finished parts. |
| Acheson® TW-067G™ | Flexible, low friction, dry film lubricant weatherstip coating with high UV durability. |
| Acheson® TW-067™ | High performance, flexible, low friction, dry film lubricant weatherstip coating. |
| Acheson® TW-068™ | Flexible, low friction, dry film lubricant weatherstip coating. Highly UV resistant appearance coating. |
| Acheson® TW-070™ | Flexible, low friction, dry film lubricant weatherstip coating ideal for glassruns and door seals. |
| Acheson® TW-081™ | Flexible, low friction, dry film lubricant weatherstip coating for multiple seal requirements of seal protection. |
| Acheson® TW-084™ | Flexible, low friction, dry film lubricant weatherstip coating. Clear coating with faster cure speeds and effective internal UV resistance. |
| Acheson® TW-090™ | Flexible, low friction, dry film lubricant weatherstip coating. Superior noise auppression for sponge seals. |
| Acheson® TW-092™ | Flexible, low friction, dry film lubricant weatherstip coating. Superior noise suppression and abrasion protection for dense seals. |
| Adhesin® 3781™ WB Bonding Adhesive | Pressure-sensitive adhesive. |
| Adhesin® 45-7348H™ | General purpose assembly |
| Adhesin® 51-3053™ | Excellent wet tack and ultimate adhesion, runs on a wide variety of equipment |
| Adhesin® 51-3093™ | General purpose assembly |
| Adhesin® 51-3130H™ | Assembly adhesive. |
| Adhesin® 51-3130™ | General purpose assembly |
| Adhesin® 51-3160H™ | Single ply corewinding, fast setting adhesive, excellent wet tack, good mechanical stability, dries clear |
| Adhesin® 51-3264BL™ | Light blue colored full resin front seal designed for use on envelopes that are to be stored under high humidity conditions |
| Adhesin® 51-5578™ | Designed for extrusion or wheel application. |
| Adhesin® 51-5654™ | Designed to bond foil/scrim/kraft to OSB. |
| Adhesin® 51-8514HUV™ | A high wet tack, fast set speed, layflat |
| Adhesin® 52-5137™ | 14% concentrate laminating adhesive |
| Adhesin® 52-6005H™ | 10% concentrate laminating adhesive |
| Adhesin® 52-6005™ | Superior, ready-for-use, laminating adhesive |
| Adhesin® 55-5005™ | General purpose assembly |
| Adhesin® 55-6007M™ | General purpose assembly |
| Adhesin® 56-0004UV™ | General purpose assembly |
| Adhesin® 56-5343™ | General purpose assembly |
| Adhesin® 56-5531™ | General purpose assembly |
| Adhesin® 56-5545™ | Water-based insulation adhesive. |
| Adhesin® 56-6135HUV™ | General purpose window patch gum |
| Adhesin® 56-7007HUV™ | Versatile general purpose patch gum adhesive for envelope equipment that runs at speeds up to 900 EPM |
| Adhesin® 56-7248TUV™ | Extrusion gum for ITW, Valco and Nordson units |
| Adhesin® 56-7248™ | Casing in resin |
| Adhesin® A 56-5532™ | High solids, roll coatable laminating adhesive. |
| Adhesin® A 56-5533™ | High solids, high viscosity spray grade adhesive. |
| Adhesin® CW 51-5360™ | General purpose, fast setting for core and tube winding; good wet tack and fast setting and repulpable |
| Adhesin® PK 53-5374™ | Transfer adhesive for bathroom tissue roller applications. Long open time and high tack with excellent dry release. Non-staining and water-soluble. |
| Adhesin® PK 6K-5374™ | Adhesin, towel pickup adhesive for blade or fountain applicators, long open time, high tack for positive transfer and excellent dry release, non-staining and water soluble |
| Adhesin® PK PL-5511MH™ | Adhesin, transfer adhesive for household toweling roller applications, long open time and high tack with excellent dry release, non-staining and water-soluble |
| Adhesin® SA-7648™ | A formulated pressure-sensitive, acrylic emulsion adhesive. |
| Adhesin® SA-9627™ | General purpose pressure-sensitive acrylic. |
| Adhesin® SIA-485B™ Anti-Wick | Latex sealer for the RV industry. |
| Adhesin® TS 53-3062H™ | Single and multi-ply tissue tail tie adhesive for spray, extrusion or squirt applications; high wet tack and water soluble; excellent release characteristics and storage stability (freeze/thaw stable) |
| Adhesin® TS PL-118T™ | Adhesin, single and multi-ply towel tail tie adhesive for spray, extrusion, or bar/wire applications, high wet tack, water soluble, and invisible when dry; excellent release characteristics |
| Adhesin® Vetak LAW1913™ | Laminating adhesive. |
| Adhesin® XA-7584™ Black | Water-based pressure sensitive adhesive |
| Adhesin® XA-7594™ Black | Water-based pressure sensitive adhesive |
| Adhesin® XA-7595™ Black | Water-based pressure sensitive adhesive |
| Adhesin® XA-7597LV™ | UL-recognized component (MH28702) laminating adhesive. |
| Adhesin® XA-7597™ | Water-based pressure sensitive adhesive |
| Adhesin® XA-7597™ Grey | UL-recognized component (MH28702) laminating adhesive. |
| Adhesin® XA-7598™ | Water-based pressure sensitive adhesive |
| AL5002™ | Water based exterior trim |
| AL5006™ | Water based exterior trim |
| AL5009™ | Water based friction |
| AL6000™ | Water based friction |
| AL6002™ | Water based friction |
| AL6004™ | Water based friction |
| AL6006™ | Water based friction |
| AL6700™ | Water based friction |
| Aldet® LNS | Liquid, non-silicated, immersion cleaner for aluminum and aluminum alloys |
| Almecolor® ST-3™ | Electrolytic coloring process for anodized aluminum |
| Almeco® 720™ | Liquid additive for Sulfuric acid anodizing baths that reduces time, energy consumption, and the amount of refrigeration required for a given anodizing process |
| Almeco® 730™ | Liquid additive for sulfuric acid anodizing baths that reduces time, energy consumption, and the amount of refrigeration required for a given anodizing process |
| Almeco® Seal NF-1™ | Nickel-free cold seal for anodized aluminum |
| Alodine® 1132™ Touch-N-Prep® Coatings | A convenient felt-tipped conversion coating repair tool. |
| Alodine® 1200S™ | Aluminum conversion coating process |
| Alodine® 1201™ | Non-flammable, acid based, chemical coating that produces a protective coating on aluminum and its alloys |
| Alodine® 120™ Brush Kit | The products are used as received to produce the protective coating on aluminum |
| Alodine® 1500™ | Liquid chemical used to produce a protective coating on aluminum or aluminum alloys |
| Alodine® 1600™ | Concentrated liquid two-package chemical used to produce a conversion coating on aluminum and all its alloys |
| Alodine® 2600™ Additive | Additive part of chrome free cobalt based conversion coating for aluminum |
| Alodine® 2600™ Makeup | Chrome free cobalt based conversion coating for aluminum |
| Alodine® 2600™ Toner | Toner part of chrome free cobalt based conversion coating for aluminum |
| Alodine® 404™ | Conversion coating process for formed aluminum cans |
| Alodine® 4595™ | Chrome-free zirconium polymer conversion coating for aluminum |
| Alodine® 5200™ | Chromium-free product formulated for treating non-ferrous alloys |
| Alodine® 5220™ | Used with Alodine® 5200™ |
| Alodine® 5700™ | Ready to use chrome-free titanium polymer conversion coating for aluminum |
| Alodine® 5700™ Wipes | Wipes ready to use chrome-free titanium polymer conversion coating for aluminum |
| Alodine® 600™ | |
| Alodine® 600™ RTU | Powdered chemical used to produce a conversion coating on aluminum and its alloys |
| Alodine® 871™ Touch-N-Prep® Coatings | A felt-tipped marker that provides a dry-in-place conversion coating on aluminum surfaces prior to painting; ideal for coating repair work |
| Alodine® EC2™ Coating Process | Electroceramic coating for aluminum and titanium alloys |
| Alodine® Magnesium Treatment Kit | Formulated for treating magnesium alloys to conform to SAE AMS-M-3171, Type VI |
| Alodine® T 5900™ | Complex trivalent chromium conversion coating formulated for treating aluminum and its alloys |
| Alodine® T 5900™ RTU | Complex trivalent chromium conversion coating formulated for treating aluminum and its alloys |
| Alodine® T 5900™ Toner | Used to build up the Alodine® T 5900™ bath |
| Aluminux® Etch L™ | Concentrated liquid alkaline product developed to produce a fine satin etch on aluminum and its alloys |
| ALWK700™ | Water based friction |
| Anoseal® 9000™ | Temperature seal for anodized aluminum (low foam) |
| Aquence® 1772™ | For heavy duty cleaning of ferrous metals prior to autodeposition |
| Aquence® 182A™ | Phosphoric acid–based, detergent-type metal cleaner and rust remover with biodegradable organic surfactants |
| Aquence® 2150™ Reaction Rinse | Environmentally friendly seal rinse technology |
| Aquence® 2592™ Alkaline Cleaner | Cleaner is a blend of inorganic alkaline components which remove moderate to heavy deposits of mill oil from ferrous substrates |
| Aquence® 2599™ | Alkaline cleaner designed to prepare steel surfaces to receive an Aquence coating |
| Aquence® 2600™ | For heavy duty cleaning of ferrous metal surfaces prior to autodeposition |
| Aquence® 2810™ | Used to remove a variety of soils, oils and forming lubricants from steel prior to the application of autodeposited coatings |
| Aquence® 2819™ Spray Alkaline Cleaner | Cleaner is a blend of inorganic alkaline components which remove moderate to heavy deposits of mill oil from ferrous substrates |
| Aquence® 2860™ | For use in immersion process equipment for heavy duty cleaning and oxide removal from ferrous metal surfaces prior to autodeposition |
| Aquence® 3416™ Reaction Rinse | Appearance enhancing seal rinse technology |
| Aquence® 7005™ Acidic Cleaner | Cleaner is a blend of inorganic acid components which remove rust and lights mill scale from ferrous substrates |
| Aquence® 7150™ | For use in spray washing systems prior to Aquence paint films and for removing light rust and oxidation from iron and steel surfaces |
| Aquence® 7310™ | For removing light rust and oxidation from iron and steel surfaces |
| Aquence® 7320™ | For removing light rust, oxidation, and oily soils from iron and steel surfaces prior to the application of Aquence coating chemicals |
| Aquence® 866IX™ - Replenisher | Used to produce a smooth, black, water-based, organic coating on ferrous metal surfaces |
| Aquence® 866™ Coating | Economical, low bake, environmentally friendly corrosion protection coating for steel parts |
| Aquence® 915IX™ | Used to produce a black organic coating on ferrous metal surfaces |
| Aquence® 915™ Coating | Economical, medium gloss, environmentally friendly corrosion protection coating for steel parts and structures |
| Aquence® 925G™ | Used to produce a grey, organic, water-based coating on ferrous metal surfaces |
| Aquence® 930IX™ | Used to produce a black organic coating on ferrous metal surfaces |
| Aquence® 930™ | For demanding applications like frames and chassis components |
| Aquence® E2™ Reaction Rinse | Seal rinse technology with enhanced chemical resistance |
| Aquence® E3™ Reaction Rinse | Seal rinse technology with enhanced corrosion resistance |
| Bonderite® 1070™ | Formulated for spray and immersion application to steel, aluminum and zinc surfaces |
| Bonderite® 1090™ | Conversion coating that inhibits corrosion and increases the adhesion and durability of paint finishes |
| Bonderite® 1303™ | Complex oxide pretreatment for hot dip galvanized or electrogalvanized |
| Bonderite® 1310™ | Chrome pretreatment for sheet and stripline applications |
| Bonderite® 1402W™ | Chrome dried in place pretreatment |
| Bonderite® 1421™ | Zinc phosphate pretreatment is for sheet and stripline applications. |
| Bonderite® 1455-W™ Wipes | Dry-in-place conversion coating for steel. |
| Bonderite® 1455™ SF | Non-chrome dried in place pretreatment |
| Bonderite® 181X™ | Conversion coating process for cold forming |
| Bonderite® 198X™ | Conversion coating process for cold forming |
| Bonderite® 1994™ | Inhibits corrosion and increases the adhesion and durability of electrodeposited finishes |
| Bonderite® 2010™ | Polycrystalline zinc phosphate conversion coating designed for multi-metal immersion applications. |
| Bonderite® 300X™ | Conversion coating process for cold forming |
| Bonderite® 3080™ | Inhibits corrosion and increases the adhesion and durability of paint finishes |
| Bonderite® 427™ RLK | Water-based |
| Bonderite® 4800™ | Oxide conversion coating for hot-dip galvanized or electro-galvanized coating |
| Bonderite® 769™ | Formulated for spray and immersion application to cold rolled steel, galvanized steel, electro-galvanized steel, zinc-alloy coated steels, and small amounts of aluminum. |
| Bonderite® 902™ | Iron phosphate pre-treatment for sheet and strip line applications. |
| Bonderite® 910™ | Formulated for spray application on multi-metal substrates prior to electrocoating. |
| Bonderite® 952™ | Polycrystalline conversion coating designed for multi-metal spray applications. |
| Bonderite® 958™ | Polycrystalline conversion coating designed for multi-metal immersion applications. |
| Bonderite® CD-3020™ | Converts the metal surface to a nonmetallic, polycrystalline coating |
| Bonderite® CD-3042™ | Zinc phosphating conversion coating chemical |
| Bonderite® K-702™ | Chrome prepaint treatment for aluminum applications |
| Bonderite® LS-1™ | Laser scale removal and conversion coating for ferrous surfaces. |
| Bonderite® NT-1™ | Ambient, nanoceramic, phosphate-free conversion coating formulated for use in multi-metal applications. |
| Bonderite® ZM-1™ | Inhibits corrosion and increases the adhesion and durability of organic paints and finishes |
| Bonderite® ZM-2™ | Internally accelerated, nickel-free polycrystalline conversion coating designed for multi-metal spray or immersion applications. |
| Bonderite® ZMX™ | Internally accelerated, nickel-free polycrystalline conversion coating designed for multi-metal spray or immersion applications. |
| Bonderlube® 204™ | A lubricant for drawing carbon steel wire and rod |
| Bonderlube® 234™ | A reactive metal forming lubricant |
| Bonderlube® 235™ | Reactive metal forming lubricant |
| Bonderlube® 745™ | Liquid non-reactive polymer lubricant for cold forging |
| Bonderlube® 755™ | Liquid non-reactive polymer lubricant for cold forging |
| Bonding Adhesive 3738T | Water-based pressure sensitive adhesive |
| Bonding Adhesive 3781 | Water-based pressure sensitive adhesive |
| Cleanox® 352A™ | A pickling process developed for stainless steel which removes the oxide layers formed during the rolling and the annealing of the metal |
| Cleanox® 352Z™ | A pickling process developed for stainless steel which removes the oxide layers formed during the rolling and the annealing of the metal |
| Deoxalume® 151™ | Nitric acid based deoxidizer for aluminum |
| Deoxidine® 182B™ | Phosphoric acid based detergent-type metal cleaner designed to remove rust and oxides left from laser cutting and welding on steel surfaces. |
| Deoxidine® 2520™ | Formulated for removal of scale from closed-loop stainless steel heat transfer systems |
| Deoxidine® 2530™ | Acidic, is specifically formulated for removal of scale from closed loop stainless steel heat transfer systems. |
| Deoxidine® 7005™ | Will effectively remove rust, scale and light deposits oil from the surface of metals while destroying corrosion stimulators. |
| Deoxidine® A-500™ | A specially formulated acid inhibitor |
| Deoxidizer® HX-357™ | Sulfuric acid based deoxidizer for aluminum |
| Deoxylyte® 100 NC™ | Chrome-free post treatment for conversion coated aluminum |
| Deoxylyte® 200NC™ | Deoxylyte® 200NC™ chromium-free, sealing rinse for aluminum |
| Dorus® 42-6100BL™ | Water-based contact adhesive |
| Dorus® 51-5659UV™ | General purpose assembly |
| Dorus® 56-3173M™ | General-purpose adhesive that can be used to bond a variety of materials |
| Dorus® 92-1000™ | Water-based, acid catalyst used to accelerate the crosslinking of specialty emulsion adhesives to create Type I and Type II bonds |
| Dorus® 92-3200™ | Catalyst |
| Dorus® AW-5474™ | Thick, elastomeric coating. |
| Dorus® KS-217™ | Designed for use in solid wood edgebanding |
| Dorus® KS-360/3™ | High heat resistant EVA for edgebanding |
| Dorus® Q-621™ | Versatile adhesive for edgebanding |
| Dorus® Q-654™ | Nearly invisible bond line |
| Dorus® R-396™ Hardener | Crosslinker |
| Dorus® SM-2000™ | Versatile soft-forming adhesive |
| Dorus® Tancotard TB-408™ | Decabromodiphenyl oxide and antimony oxide in water. |
| Dorus® US-276-21™ | General purpose profile wrapping adhesive |
| Dorus® US-280/4™ | Good adhesion to difficult substrates |
| Drawco® DFL 767™ | Dry film lubricant |
| DTI® 360™ Coolant | Biostable bodymaker coolant for drawing and ironing of aluminum beverage cans |
| DTI® 8100-A™ Post Lube | Post-lubricant applied electrostatically to drawn and ironed aluminum can stock |
| DTI® 820™ Coolant | Bodymaker coolant/lubricant for drawing and ironing of tinplate food and beverage cans |
| DTI® C1-A™ Cupper | Cupper lubricant for drawing and ironing of aluminum beverage cans |
| DTI® CL-500™ Cupper | Neat cupper lubricant for drawing and ironing of aluminum beverage cans |
| DTI® I-102™ Coolant | Biostable bodymaker coolant for drawing and ironing of aluminum beverage cans |
| DTI® M3-A™ Cupper | Cupper lubricant for drawing and ironing of aluminum beverage cans |
| DTI® TPS 600™ Cupper | Cupper lubricant for drawing and ironing of tinplate food and beverage cans |
| Dualite® E030™ | Ultra low density expanded polymeric microsphere |
| Dualite® E065-135D™ | Low density expanded microsphere |
| Dualite® E130-055D™ | Ultra-low density polymeric shell to which is affixed an inert exterior coating |
| Dualite® E130-095D™ | High performance expanded polymeric microsphere |
| Dualite® E130-105D™ | General purpose expanded polymeric microsphere |
| Dualite® E130-105W™ | General purpose water blended (non-dusting) expanded polymeric microsphere. |
| Dualite® E135-040D™ | Small particle size expanded polymeric microsphere |
| Dualite® U005-190™ | High temperature, high expanding expandable polymeric microsphere |
| Dualite® U010-135™ | Low temperature expandable polymeric microsphere |
| Dualite® U017-175™ | Mid temperature expandable polymeric microsphere |
| Dualite® U0180-130™ | Low temperature expandable polymeric microsphere |
| Dualite® U020-125W™ | Low temperature expandable polymeric microsphere (wet) |
| Dualite® U024-145™ | Low temperature expandable polymeric microsphere |
| EA 1010™ | Liquid additive used in combination with dry or liquid caustic to produce a high quality etchant for aluminum and its alloys |
| EA 1022™ | Liquid concentrate used in a caustic etch baths to produce a consistent matte, fine grain etch on aluminum and its alloys |
| Euromelt® 80-8626™ | Medium viscosity, repositionable pressure sensitive hot melt adhesive for use on pre-applied labels |
| Euromelt® 80-8669™ | Removable pressure sensitive hot melt |
| Euromelt® 80-8697™ | General purpose and pressure sensitive hot melt |
| Euromelt® 80-8707™ | Long open time, general purpose hot melt |
| Euromelt® EM-112US™ | Low viscosity semi-pressure sensitive hot melt for roll fed container labeling |
| Euromelt® EM-362™ | High performance full pressure sensitve hot melt for container labeling |
| Euromelt® EM-369™ | High performance full pressure sensitve hot melt, hot fill and high speed applications |
| Euromelt® EM-377™ | High performance, low viscosity, pressure sensitive labeling hot melt designed to run on roll or magazine fed labelers |
| Euromelt® EM-746US™ | Medium viscosity hot melt pressure sensitive designed for permanent tape and label applications |
| Euromelt® EM-799US™ | Medium viscosity hot melt pressure sensitive designed for crystal clear, no-look label applications |
| Fixodine® AO™ | Powder based titanium containing surface conditioner designed to promote the formation of a dense, complete and fine grained phosphate coating for use in in-line wire and rod phosphating applications. |
| Fixodine® M™ | Powdered surface conditioning agent formulated to promote a fine, dense crystalline phosphate coating on iron and steel surfaces. |
| Fixodine® Z10™ | Powder based surface conditioner designed to promote a refined crystalline structure when in a zinc phosphate coating application. |
| Fixodine® ZL™ | Liquid based surface conditioner designed to promote a refined crystalline structure when in a zinc phosphate coating application. |
| Floorguard XA-9952 Blue | Water-based coating |
| Frekote® 1450™ | Water based solution, specifically formulated for use with resin/asbestos products |
| Frekote® 1711-1™ | A silicone solvent based mold release agent that offers a high gloss finish with excellent part detail and mold geometry retention |
| Frekote® 1711™ | Silicone mold release agent |
| Frekote® 44-NC™ | Non-CFC release agent with the same polymeric base as Frekote 44-NC, with only a slight modification in the solvent blend for better non-transference. |
| Frekote® 44-NC™ Wipes | A conveniently packaged release agent wipe for high performance composite assemblies |
| Frekote® 48-NC™ | Non-CFC release agent designed to provide multiple releases with no contaminating transfer |
| Frekote® 55-NC™ | Non-CFC release agent designed to provide multiple releases with no contaminating transfer |
| Frekote® 55-NC™ Wipes | A conveniently packaged release agent wipe for high performance composite assemblies |
| Frekote® 700-NC™ | Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins |
| Frekote® 710-LV™ | A Low VOC Semi-permanent release agent for high performance composite assembly |
| Frekote® 710-NC™ | Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins |
| Frekote® 720-NC™ | A semi-permanent release agent formulated specifically for release of all cast polymer products and for releasing highly filled resins |
| Frekote® 770-NC™ | Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins |
| Frekote® 800-NC™ | Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins |
| Frekote® 810-NC™ | Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins |
| Frekote® 815-NC™ | Non-CFC, semi-permanent, multiple release polymer resin that effectively releases all thermoset resins |
| Frekote® 901WB™ | Proprietary water-based emulsion developed for releasing aerospace and other high performance composite structures |
| Frekote® 915WB™ | A water based cleaner developed for removing residue from mold surfaces |
| Frekote® AC4368™ | All-purpose, silicone based release agent |
| Frekote® Aqualine® C-600™ | Semi-permanent mold release agents |
| Frekote® Aqualine® PUR-100™ | Water-based mold release for polyurethane elastomers |
| Frekote® Aqualine® R-100™ | Water-based mold release agent for rubber goods |
| Frekote® Aqualine® R-110™ | Water-bassed mold release agent for rubber goods |
| Frekote® Aqualine® R-120™ | Generic mold release agent rubber-to-metal bonded parts |
| Frekote® Aqualine® R-150™ | Water-based mold release agent for the more difficult molding applications for rubber goods |
| Frekote® Aqualine® R-180™ | Water-based mold release agent for the most difficult molding applications |
| Frekote® Aqualine® R-220™ | A water based release agent formulated for the most difficult to release molding applications |
| Frekote® Aqualine® R-550™ | Formulated for the most difficult rubber molding applications, especially parts with high aspect ratios |
| Frekote® Aqualine® R-95™ | Water-based mold release agent for easy molding application of rubber goods |
| Frekote® Aqualine® RC-321™ | Water-based mold release agent for rubber goods |
| Frekote® Aqualine® Rotolease™ | Water-based mold release agent for rotation molding application |
| Frekote® B-15™ Sealer | Sealer for molds with microporosity problems, small surface scratches or imperfections |
| Frekote® C-200™ | Unique water-based release agent with high temperature stability for thermoset composites |
| Frekote® C-210™ | Unique water-based release agent with high temperature stability for thermoset composites |
| Frekote® CMR™ | A cleaner and mold release for polyester mold surfaces |
| Frekote® CUR™ | Mold release designed to form a semi-permanent release coating on the mold surface for rigid, cast polyurethane products |
| Frekote® EFR™ | Semi-permanent, polymeric release agent for flange sealing on composite molds |
| Frekote® EXITT-EM™ | Mold release product for epoxy and urethanes |
| Frekote® EXITT-I™ | Silicone mold release agent |
| Frekote® EXITT™ | A sacrificial mold release developed specifically for urethane elastomer systems |
| Frekote® FMS™ | Mold sealer for fiberglass reinforced polyester, epoxy and other composite molds |
| Frekote® Frewax® | Unique combination of wax and a semi-permanent polymer release agent |
| Frekote® FRP-NC™ | Semi-permanenant mold release agent specifically formulated for reinforced polyester gel coats |
| Frekote® HMT™ | Hot mold touch up version of Frekote® 44-NC™ |
| Frekote® LIFFT-1™ | Offers a high gloss finish with excellent part detail and mold geometry retention |
| Frekote® LIFFT™ | Silicone solvent based mold release agent. Offers a high gloss finish with excellent part detail and mold geometry retention. |
| Frekote® PMC™ | Mold cleaner designed to dissolve and remove wax from polyester molds without dulling the surface |
| Frekote® PUR-NC™ | Non-CFC, semi-permanent, multiple release polymer resin for rigid, cast polyurethane products |
| Frekote® Rel-Eaze™ | A High performance product developed for releasing sand cores |
| Frekote® Rimlease 8™ | release interface for RIM and R/RIM polyurethane processes |
| Frekote® S-50™ | Mold release for silicone rubber |
| Frekote® SOLO™ | A unique polymer release agent designed for all gel-coat fiberglass reinforced and filled polyester composites |
| Frekote® WOLO HS™ | A unique polymer release agent with high slip characteristics |
| Frekote® WOLO LV™ | A low VOC semi-permanent release agent for polyester gel-coat parts |
| Frekote® WOLO™ | A semi-permanent release agent for polyester gel-coat parts |
| Granocoat® 342™ | Non-chrome acrylic for long term passivation of galvanized and galvalume substrates |
| Granocoat® ZE™ | Zinc rich, weldable primer |
| Hysol® AC0305™ | Universal extrudable heat seal coating. |
| Hysol® AL 2000 | Nitrile/phenolic, water based primer |
| Hysol® CB064™ | High purity, low stress, liquid, self-leveling encapsulant material. |
| Hysol® DK18-05™ Blue & Gold | Blue & Gold is a one part, low temperature fusing epoxy powder especially designed for all types of capacitors including film, ceramic and tantalum. |
| Hysol® DK18-0913GR™ New Green | |
| Hysol® DK29-0982™ | One part, epoxy coating powder designed for the encapsulation of various types of electronic devices |
| Hysol® DK30-0952™ | |
| Hysol® DK38A-05GR™ New Green | |
| Hysol® DK42™ Gold Mold Compount | |
| Hysol® EA 9150 | RTM resin, 250°F/121°C service, epoxy, two component |
| Hysol® EA 9203 | Adhesion promoting coating, room temperature cure |
| Hysol® EA 9257 | Adhesive primer, solvent based, high temperature, 350°F/177°F curing, chromated |
| Hysol® EA 9258.1™ | High temperature, water-based, chromated adhesive primer |
| Hysol® EA 9309.3NA | Toughened paste, high peel, two component, ambient cure, 180°F/82°C service |
| Hysol® EA 9313 | Toughened paste, high peel, two component, ambient cure, 180°F/82°C service |
| Hysol® EA 9320NA | Toughened paste, high peel, two component, ambient cure, 180°F/82°C service |
| Hysol® EA 9321 | Filled paste, 250°F/121°C service temperature, ambient cure |
| Hysol® EA 9323 | Filled paste, 250°F/121°C service temperature, ambient cure |
| Hysol® EA 9330 | Toughened paste, thixotropic, 180°F/82°C service |
| Hysol® EA 9330.3 | Toughened paste, thixotropic, 180°F/82°C service |
| Hysol® EA 9346.5 | Toughened paste, one part, elevated cure, 250F/121°C service |
| Hysol® EA 934NA | Filled paste, 300°F/149C service temperature, ambient cure |
| Hysol® EA 9359.3 | Toughened paste, high peel strength, volumetric mix ratio, 200°F/93°C service temperature |
| Hysol® EA 9360 | Toughened paste, high peel strength, volumetric mix ratio, 200°F/93°C service temperature |
| Hysol® EA 9361 | Toughened paste, high elongation, 140°F/60°C service temperature |
| Hysol® EA 9371 | Toughened paste, high elongation, 140°F/60°C service temperature |
| Hysol® EA 9377 | Filled paste, liquid shim, non-microcracking |
| Hysol® EA 9380 | Toughened paste 250°F/121°C service temperature, structural |
| Hysol® EA 9390 | Low viscosity resin, composite repair, laminating, 350°F/177°C service temperature |
| Hysol® EA 9392 | Toughened paste, 350°F/177°C service temperature, thixotropic |
| Hysol® EA 9394 | Filled paste adhesive, thixotropic, liquid shim, 350°F/177°F service temperature, low peel |
| Hysol® EA 9394.2 | Filled paste, liquid shim, fast cure, 225°F/107°C service temperature |
| Hysol® EA 9394/C-2 | Filled paste, elevated cure, 450°F/232°C service temperature, high temperature |
| Hysol® EA 9395 | Non-metallic filled paste adhesive, thixotropic, liquid shim, 350°F/177°F service, low peel |
| Hysol® EA 9396 | Low viscosity resin, 350°F/177°C service temperature, composite repair resin, room temperature cure |
| Hysol® EA 9396.6MD | Syntactic low density paste, 300°F/149°F service, room temperature cure, lightweight |
| Hysol® EA 9396/C-2 | Low viscosity resin, composite repair, laminating, 400°F/204°C service temperature, elevated cure |
| Hysol® EA 956 | Low viscosity resin, 300°F/149°C service temperature, repair resin, room temperature cure |
| Hysol® EA 9602.3 | Metal bond film adhesive, 250°F/121°C service temperature |
| Hysol® EA 960F | Lightweight fairing compound, 200°F/93°C service temperature, low density, sandable |
| Hysol® EA 9628 | Metal bond film adhesive, 250°F/121°C service temperature |
| Hysol® EA 9628H | Metal bond film adhesive, 250°F/121°C service temperature |
| Hysol® EA 9657 | Film adhesive, 400°F/204°F service temperature |
| Hysol® EA 9658™ | Film adhesive, high temperature, 420°F/216°C service temperature |
| Hysol® EA 9673 | Bismalimide film adhesive, 550°F/288°C service temperature |
| Hysol® EA 9686 | Film adhesive, 250°F/121°C cure, 300°F/149°C service temperature |
| Hysol® EA 9689 | Film adhesive, high temperature, 420°F/216°C service temperature |
| Hysol® EA 9695 | Film adhesive, composite bonding, 300°F/149°C service temperature |
| Hysol® EA 9696 | Film adhesive, metal or composite bond |
| Hysol® EA 9815™ | Paste adhesive, one part, elevated cure, expanding, 250°F/121°C service temperature |
| Hysol® EA 9833.1 | Core splice, bismalimide, 450°F/232°C service temperature |
| Hysol® EA 9895™ WPP | Peel ply, pre-impregnated, polyester scrim |
| Hysol® EE8200 / EB80363™ | Solvent free, flexible, two-component epoxy potting system which meets the requirements of UL 94 VO, 1/4 inch. |
| Hysol® EO1016™ | Unique one component epoxy encapsulant with excellent shelf stability, flame-out and fast curing capability at moderate temperature. |
| Hysol® EO1061™ | One of a series of high performance, single component, semiconductor encapsulants for chip-on-board applications. |
| Hysol® EO1062™ | One of a series of high performance, single component, semiconductor encapsulants for chip-on-board applications. |
| Hysol® EO1072™ | One component high performance epoxy encapsulant with high Tg and low extractable ionics. |
| Hysol® EO1080™ | Unique one component epoxy encapsulant with excellent shelf stability and fast curing capability at moderate temperature. |
| Hysol® EO7038™ | One component epoxy potting system formulated to protect sensors used in harsh environments, such as automotive applications. |
| Hysol® ES0613™ | Undiluted epoxy 100% solids system, should be used where very low mixed viscosity is not a critical requirement. |
| Hysol® ES0614™ | Undiluted epoxy, low viscosity casting system that exhibits exceptional resistance to impact and thermal shock. |
| Hysol® ES0615™ | Unfilled epoxy system with a high operating temperature and long pot life. |
| Hysol® ES0616™ | Undiluted, silica filled epoxy casting compound, which exhibits improved thermal properties, lower shrinkage and lower expansion characteristics. |
| Hysol® ES0617™ | Filled system offering improved thermal conductivity and increased resistance to heat and thermal shock. |
| Hysol® ES0618™ | Filled epoxy system with a high operating temperature and long pot life. |
| Hysol® ES0619™ | Soft, flexible, filled, black epoxy casting system with improved adhesion characteristics, good heat resistance, and a convenient mix ratio. It is best suited for low stress applications. |
| Hysol® ES1000™ | Black, low cost, flexible, capable of UL94HB, resistant to thermal shock, non-abrasive filled, high impact strength, long pot life |
| Hysol® ES1001™ | X-Ray opaque, low cost, flexible, resistant to thermal shock, non-abrasive filled, high impact strength, easy handling |
| Hysol® ES1002™ | Black, low cost, flexible, capable of UL94V-0, non-abrasive filled, long pot life |
| Hysol® ES1003™ | Filled, low viscosity, heat cure. Low expansion, excellent thermal properties and excellent imprgenation of fine windings |
| Hysol® ES1004™ | Capable of UL94V-0, stable to 155C |
| Hysol® ES1005™ | Low stress, excellent resistance to thermal and mechanical shock, long working time |
| Hysol® ES1300™ | Excellent imprgnation of the most demanding coils and transformers, very high strength and excellent crack resistance |
| Hysol® ES1301™ | Long working time, excellent imprognation of fine windings |
| Hysol® ES1900™ | Clear, low shrinkage, excellent chemical resistance, strong bond to substrates |
| Hysol® ES1901™ | Tough, fast setting, optically clear, low viscosity, room temperature curing, chemical resistant, industrial grade epoxy adhesive potting/encapsulating material. |
| Hysol® ES1902™ | Clear, transparent, very fast UV gel with thermal co-cure, excellent dimensional stability, low viscosity, easy to handle |
| Hysol® ES2200™ | Excellent adhesion to a wide variety of substrates, capable of UL94V-0, resilient |
| Hysol® ES2201™ | Excellent adhesion to a wide variety of substrates, resilient, low cracking |
| Hysol® ES2202™ | High heat distortion temperature, Excellent chemical resistance, excellent performance under high moisture and humidity. |
| Hysol® ES2203™ | Low shrinkage, low thermal expansion high heat distortion temperature. |
| Hysol® ES2204™ | Improved thermal conductivity, high impact strength even at high temperatures, excellent crack resistance. |
| Hysol® ES2205™ | High operating temperature, excellent chemical resistance, long working life, excellent performance under high moisture and humidity. |
| Hysol® ES2206™ | Excellent adhesion, low hardness, flexible |
| Hysol® ES2207™ | High heat distortion temperature, low expansion, dimensionally stable |
| Hysol® ES2500™ | Black, fast gel, capable of UL1446 to 180C and UL94HB at 6mm, Easy handling, resilient |
| Hysol® ES2501™ | Very fast gel, fast cycle time |
| Hysol® ES2502™ | Low corona, resistant to arc track failure, stable at high frequencies, high impact strength, easy handling |
| Hysol® ES4212™ | Two-component, long pot life, casting system with excellent handling properties. |
| Hysol® ES4412™ | Two-component casting system with excellent handling properties. |
| Hysol® ES4512™ | Two-component casting system with excellent handling properties. |
| Hysol® ES6005™ | Resilient, low cost, fast gelling, potting compound. |
| Hysol® ES6020™ | Two-component casting system with excellent handling properties. |
| Hysol® FF2200™ | Reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. |
| Hysol® FF2300™ | Reflow encapsulant designed for the assembly and protection of flip chip semiconductor devices utilizing a single material approach. |
| Hysol® FP0114™ | Low viscosity, fast flow, epoxy based material designed for capillary underfill on flip chip applications. |
| Hysol® FP4450HF™ | High purity, self-leveling liquid epoxy encapsulant. |
| Hysol® FP4450LV™ | High purity, low stress liquid encapsulant. |
| Hysol® FP4450™ | High purity, low stress liquid encapsulant with good moisture resistance and an extended working life. |
| Hysol® FP4460™ | High purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products. |
| Hysol® FP4470™ | High purity liquid encapsulant designed for use in applications utilizing lead-free solder. |
| Hysol® FP4526™ | Low viscosity, fast flow, epoxy based material. |
| Hysol® FP4530™ | Fast flow encapsulant material for flip chip underfill applications with a gap of 1 mil. |
| Hysol® FP4545FC™ | |
| Hysol® FP4548FC™ | High purity, liquid epoxy encapsulant designed as an underfill for flip chip devices. |
| Hysol® FP4652™ | High purity, self-leveling liquid epoxy encapsulant designed for larger cavity-fill or dam-and-fill applications. |
| Hysol® FP5000™ | One part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. |
| Hysol® FP5001™ | One part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. |
| Hysol® FP6101™ | Unfilled flexible epoxy designed as a removable CSP or BGA underfill. |
| Hysol® GK3100™ New Green | Passive components, including all capacitor types |
| Hysol® GR15F-1™ | |
| Hysol® GR15F-A™ | |
| Hysol® GR2310™ | Gold/non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors |
| Hysol® GR2320™ | Black/non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors |
| Hysol® GR2710™ | Gold, low stress, non-flame retardant molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors |
| Hysol® GR2820™ | Gold, ultra low stress, non-halogenated molding powder, tantalum and ceramic capacitors, leaded or surface-mounted sensors |
| Hysol® GR360A-F8™ | Green mold compound with 1/8" flammability rating, good moldability with lowest cost of ownership |
| Hysol® GR360A™ | |
| Hysol® GR625A™ | |
| Hysol® GR640FF™ | |
| Hysol® GR640HV™ | Low stress green molding compound, superior moldability and reliability with lowest cost of ownership |
| Hysol® GR640MOD™ | |
| Hysol® GR725-AG™ | |
| Hysol® GR750™ | |
| Hysol® GR828A™ | |
| Hysol® GR828D™ | Ultra low stress, high adhesion molding compound |
| Hysol® GR828HS™ | Low stress green molding compound with Ni/Pd and copper leadframes |
| Hysol® GR828™ | |
| Hysol® HL100-3™ | Low stress epoxy encapsulant designed for use on Al, Ga, As and similar stress sensitive LED devices |
| Hysol® Huawei KL-1000-3AF™ | A low stress molding compound suitable for GBU, KBU and TO packages, providing superior moldability and reliability. |
| Hysol® Huawei KL-1000-3A™ | Standard molding compound suitable for ZIP, SIL and DIP packages, providing superior moldability and reliability. |
| Hysol® Huawei KL-1000-3LX™ | Standard molding compound suitable for ZIP, SIL and DIP packages, providing superior moldability and reliability. |
| Hysol® Huawei KL-1000-3NP™ | A low stress molding compound suitable for DO and TO-92/220 packages, providing superior moldability and reliability. |
| Hysol® Huawei KL-1000-4T™ | Lowest cost of ownership with superior moldability and reliability, extremely suitable for DIP packages |
| Hysol® Huawei KL-2500-1K™ | Low thermal expansion and low stress molding compound suitable for GBU,KBU,TO,ZIP,SIP,DIP and SDIP packages, providing superior moldability and reliability. |
| Hysol® Huawei KL-4000-1™ | Low thermal expansion and low stress molding compound suitable for DIP,PDIP,SOIC, SOP, SSOP packages, providing superior moldability and reliability. |
| Hysol® Huawei KL-4500-1NT™ | Low stress and high reliability molding compound suitable for TO,SOIC,SOP,SSOP and QFP packages, providing high purity and low uranium content. |
| Hysol® Huawei KL-4500-1N™ | Low stress and high reliability molding compound suitable for TO, SOP and SSOP packages. |
| Hysol® Huawei KL-4500-1S™ | Low stress molding compound suitable for SOT, D-PAK and D2-PAK packages, providing high purity and high reliability. KL-4500-1S™ meets JEDEC Level 1/260C. |
| Hysol® Huawei KL-4500-1™ | Low stress and high reliability molding compound suitable for TO, SOIC ,SSOP and QFP packages, providing high purity and low uranium content. It’s low viscosity properties enables low wire sweep molding with a large operating window. |
| Hysol® Huawei KL-5000-HT™ | High thermal conductivity molding compound suitable for full packages such as TO-220F/3PF, providing low moisture absorption and low thermal expansion. |
| Hysol® Huawei KL-6500H™ | High adhesion & low stress molding compound suitable for SOIC, D/D2-PAK and QFP packages. |
| Hysol® Huawei KL-6500S™ | Low stress molding compound suitable for SOT,SOD,SOP and SSOP packages, providing good workability and high reliability. |
| Hysol® Huawei KL-7000HA™ | High adhesion and high strength molding compound suitable for SOT,SOD,SSOP,TSOP,QFP and T/LQFP packages, providing ultra low stress, low moisture absorption, high purity and high reliability. |
| Hysol® Huawei KL-8000H™ | High adhesion and high strength molding compound suitable for SSOP, TSOP, QFP and T/LQFP packages, providing ultra low stress, low moisture absorption, high purity and high reliability. |
| Hysol® Huawei KL-9000H™ | Standard molding compound suitable for PBGA and TFBGA packages, providing high adhesion and high strength, low stress, low warpage and high reliability. |
| Hysol® Huawei KL-G200™ | Green mold compound suitable for transistors such as Diodes and TO packages; contains no bromine, antimony or phosphorus flame retardant. |
| Hysol® Huawei KL-G300A™ | Green mold compound suitable for Diodes, TO and PDIP packages; contains no bromine, antimony or phosphorus flame retardant. |
| Hysol® Huawei KL-G450H™ | Low stress, green mold compound suitable for SOP, SOJ and QFP; contains no bromine, antimony or phosphorus flame retardant. |
| Hysol® Huawei KL-G650H™ | High adhesion, ultra low stress, green mold compound suitable for TSOP, TSSOP and QFP; contains no bromine, antimony or phosphorus flame retardant. |
| Hysol® Huawei KL-G680H™ | High adhesion, ultra low stress, green mold compound suitable for QFP; contains no bromine, antimony or phosphorus flame retardant. It’s low viscosity properties enables low wire sweep molding with a large operating window. |
| Hysol® Huawei KL-G730™ | Superior adhesion technology and enhanced reliability performance |
| Hysol® Huawei KL-G750™ | Superior adhesion technology and enhanced reliability performance |
| Hysol® Huawei KL-G800H™ | High adhesion, ultra low stress, green mold compound suitable for TSOP, D/D2PAK and L/TQFP and contains no bromine, antimony or phosphorus flame retardant. |
| Hysol® Huawei KL-G800lmp™ | A high adhesion, ultra low stress, green mold compound |
| Hysol® Huawei KL-G820™ | High adhesion, low warpage and ultra low stress green mold compound suitable for QFN and contains no bromine, antimony or phosphorus flame retardant. |
| Hysol® Huawei KL-G850™ | High adhesion, ultra low stress, green mold compound suitable for QFN and BGA and contains no bromine, antimony or phosphorus flame retardant. |
| Hysol® Huawei KL-G900H™ | High adhesion, ultra low stress, green mold compound suitable for BGA and contains no bromine, antimony or phosphorus flame retardant. |
| Hysol® MA 557 | Epoxy core splice, 350°F/177°C service temperature |
| Hysol® MA 562 | Epoxy core splice, 350°F/177°C service temperature |
| Hysol® MA 562S | Epoxy core splice, 350°F/177°C service temperature |
| Hysol® MA 562SFR | Epoxy core splice film, fire retardant, 350°F/177°C service temperature |
| Hysol® MG15F | |
| Hysol® MG15F-0140R™ | Anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperature |
| Hysol® MG15F-35A™ | Anhydride cured molding compound designed for use in high voltage power applications requiring good electrical stability at high temperature |
| Hysol® MG15F-60A™ | Anhydride chemistry with spherical fused silica filler, designed for high voltage power applications requiring good electrical stability at high temperature |
| Hysol® MG15F-MOD2™ | Very high Tg, low stress, green semiconductor grade, epoxy molding compound designed specifically for use in asymmetric and surface mount packages; specifically with high temperature power, and high speed RF applications |
| Hysol® MG15F-R™ | Power discrete, RF and high voltage rectifier, designed for high voltage power applications requiring good electrical stability at high temperature |
| Hysol® MG17-0604F™ | White epoxy molding compound specifically formulated for use as an overmold for opto coupler devices |
| Hysol® MG18-5129™ | Visually opaque, black epoxy molding compound specifically designed for IR electronic applications such as IR transceivers and IR photo modules |
| Hysol® MG18™ | Transparent epoxy molding compound, developed specifically for the encapsulation of optoelectronic devices |
| Hysol® MG21-02™ | High productivity, low cost material designed for low voltage diodes and small signal transistors |
| Hysol® MG33F-0588™ (Gold) | Specially formulated product designed for use in high volume molding of tantalum capacitors |
| Hysol® MG33F-0593™ (Black) | Tantalum and ceramic capacitors, leaded surface mount sensors |
| Hysol® MG33F-0602™ (Black) | Tantalum and ceramic capacitors, leaded surface mount sensors automotive |
| Hysol® MG35F™ | High productivity molding compound, designed specifically for high volume encapsulation of discrete semiconductor devices |
| Hysol® MG46F-AM™ | Automold |
| Hysol® MG52F-08™ | High productivity, low stress, molding compound designed for high volume encapsulation of various surface mount devices |
| Hysol® MG97-8000™ | Transparent epoxy molding compound specifically designed for surface mount optoelectronic devices such as LEDs, image sensors and opto sensors. |
| Hysol® MH20-01™ (Black or Gold) | Automotive sensors, solenoid coils, transformers and switches |
| Hysol® OP1000™ | Premier pelletized optoelectronic molding compound |
| Hysol® OP2000™ | Pelletized optoelectronic molding compound with advanced adhesion properties |
| Hysol® OP3000™ | Pelletized optoelectronic molding compound with advanced adhesion properties, enhanced cure speed |
| Hysol® OP8000™ | Pelletized optoelectronic molding compound with internal release, fast cure for automold application |
| Hysol® OS1600™ | Water white casting system suitable for use on visible and I.R. L.E.D. |
| Hysol® OS2902™ | Low stress, high performance L.E.D. casting system for discrete L.E.D.'s and displays |
| Hysol® OS4210™ | Low viscosity, long pot life encapsulating system that cures at 85°C or above to yield clear water white castings |
| Hysol® PC12-007M™ | 100 percent solids, general purpose, epoxy printed circuit coating developed to meet military requirements |
| Hysol® PC18M™ | Solvent based one component urethane coating which may be cured at room temperature |
| Hysol® PC20M™ | Stable, clear material, suitable for continuous operation up to 110ºC |
| Hysol® PC28STD™ | Solvent-based, urethane coating; a one component, air-drying, room temperature cure, printed circuit coating material |
| Hysol® PC30STD™ | Waterborne acrylic, one component coating recommended for printed board coating |
| Hysol® PC54™ | One-component solvent based acrylic conformal coating to provide environmental and mechanical protection to printed circuit boards |
| Hysol® PL 460 | Epoxy foaming paste, expanding, 350°F/177°C service temperature |
| Hysol® PL 639™ | Nitirile phenolic film adhesive, 350°F/177°C service temperature |
| Hysol® PL 663 | Nitirile phenolic film adhesive, 270°F/132°C service temperature |
| Hysol® PL 685 | Epoxy core splice film, expanding, 350°F/177°C service temperature |
| Hysol® PL 7000™ | Composite bond film adhesive, 300°F/149°C service temperature |
| Hysol® PL 737 | Film adhesive, 350°F/177°C service, non-metallic filled |
| Hysol® PL 777 | Film adhesive, 300°F/149°C service, non-metallic filled |
| Hysol® PL 777-1FR | Film adhesive, fire retardant, 300°F/149°C service, non-metallic filled |
| Hysol® PL 780-1 | Film adhesive, high temperature 350°F/177°C service temperature, non-metallic filled |
| Hysol® PL 795 | Film adhesive, composite bonding, 300°F/149°C service temperature |
| Hysol® PL 795-1 | Film adhesive, composite bonding, 300°F/149°C service temperature |
| Hysol® PL 795-1SF™ | Composite surfacing film, epoxy |
| Hysol® PL 795SF™ | Composite surfacing film, epoxy |
| Hysol® QMI168™ | Silver filled conductive adhesive for attachment of integrated circuits and components to metal leadframes, designed for high volume production applications |
| Hysol® QMI2419M™ | No dry Ag/glass die attach for glass seal packages |
| Hysol® QMI2569™ | Wide temperature processing, no-dry, silver glass die attach adhesive for the attachment of integrated circuits in both solder seal and glass seal hermetic packages |
| Hysol® QMI3555R™ | Low temperature processing, no dry, silver glass die attach adhesive for the attachment of integrated circuits in both solder seal, seam seal and glass seal hermetic packages |
| Hysol® QMI505MT™ | Silver filled conductive adhesive for attachment of integrated circuits and components to advanced metal and ceramic substrates |
| Hysol® QMI516™ | Silver filled conductive adhesive for attachment of integrated circuits and components to advanced substrates |
| Hysol® QMI519™ | Silver filled conductive adhesive for attachment of integrated circuits and components to metal lead-frames |
| Hysol® QMI529HT™ | Highly silver filled, conductive adhesive designed to provide high (6-7 W/m°K) thermal conductivity and excellent electrical conductivity for attachment of integrated circuits and components to metallic lead frames |
| Hysol® QMI529LS™ | Low stress, silver-filled, low bleed conductive die attach adhesive specifically recommended for Ag/Cu and bare Cu lead frame applications |
| Hysol® QMI529NB™ | Silver-filled, no bleed conductive, UV curable die attach adhesive specifically recommended for NiPdAu leadframe applications |
| Hysol® QMI536HT™ | Boron nitride filled non-electrically conductive adhesive for attachment of integrated circuits and components to advanced substrates |
| Hysol® QMI550SI™ | Silica filled non-conductive adhesive designed for use in stacked chip scale packages (SCSP) in the first die attach position |
| Hysol® QMI600™ | For stacked die application where the bonding wires go through the die attach paste and mold compound |
| Hysol® TF 3056FR™ | Low density syntactic epoxy paste, core fill |
| Hysol® UF3800™ | A high reliability, reworkabe, room temperature dispensable underfill. |
| Hysol® US5520™ | Inexpensive, low viscosity, flexible, flame retardant, castor/MDI based urethane potting/encapsulating compound |
| Hysol® US5529™ | Flexible, flame retardant, mineral filled, polyurethane compound |
| Hysol® US5538™ | Flexible, unfilled, potting compound; this system provides low viscosity for good flow and good adhesion to many substrates |
| Hysol® US5544™ | Fast gelling, flexible, flame-retardant, mineral-filled, polyurethane compound |
| Krytox® RFE Advanced PTFE Dry Lubricant | High performance, synthetic, long-lasting |
| Krytox® RFE PFPE High Performance Lubricant | Synthetic, long-lasting lubrication |
| Krytox® RFE PFPE Lubricant | Excellent lubrication properties over a broad temperature range |
| Laticote® B7406AM™ | Matte, sheet in-line |
| Laticote® B7472AB™ | High gloss, high rub, sheet in-line |
| Laticote® B7532A1™ | Ultra gloss, high rub, sheet in-line |
| Laticote® B7810AS™ | Satin, sheet in-line |
| Laticote® B7810A™ | Gloss, sheet in-line |
| Latiseal® A7734A™ | Standard waterbased low seal temperature heat seal coating for medical/food applications |
| Latiseal® A7914AN™ | Standard water based heat seal for medical grade paper applications |
| Latiseal® B7710AR™ | Standard In-line water-base PUR |
| Latiseal® F9022N™ | Solvent based heat seal coating for blister card packaging applications. It gives fiber-tearing bonds to rigid vinyl, polystyrene, polyester and other blisters. |
| Liofol® Tycel® 393™ | One component solvent based laminating adhesive for standard applications. |
| Liofol® Tycel® 7668/7276™ | Two component solventless adhesive for medium to high performance. |
| Liofol® Tycel® 7900/7283™ | Two component solvent based high performance adhesive. |
| Liofol® Tycel® 7910™ | One component solventless adhesives for paper lamination. |
| Liofol® Tycel® 7966/7287™ | Two component solvent based adhesive for medium to high performance applications. |
| Liofol® Tycel® 7975/7276™ | Two component solventless adhesive for low to medium performance applications. |
| Liofol® Tycel® 7991/6093™ | Two component aliphatic solventless adhesive for retort applications. |
| Liofol® UR 2780 / UR 5891 | Two component aliphatic solvent based retort laminating adhesive. |
| Loctite® 0151™ Hysol® Epoxy Adhesive | General purpose, ultra clear epoxy paste |
| Loctite® 0232™ Hysol® Hot Melt Adhesive | Medium setting, hot melt adhesive |
| Loctite® 0430™ Hysol® SprayPac® Polyshot™ Hot Melt Adhesive | Bonding expanded polystyrene, polyethelene, and urethane foams |
| Loctite® 0437™ Hysol® SprayPac® Polyshot™ Hot Melt Adhesive | Formulated for spray application |
| Loctite® 0450™ Hysol® SprayPac® Polyshot™ Hot Melt Adhesive | Formulated for spray applications |
| Loctite® 0452™ Hysol® SprayPac® Hot Melt Adhesive | Spray-applied to a wide variety of substrates. Excellent for bonding expanded polystyrene or urethane foams. |
| Loctite® 11C™ Hysol® Epoxy Adhesive | General purpose epoxy, bonds and seals, machinable |
| Loctite® 128068™ Thread Sealant | Slow curing for gearbox flange sealing |
| Loctite® 193124 R 5GA™ | Provides structural strength and flexible potting characteristic |
| Loctite® 193125 H 5GA™ | Provides structural strength and flexible potting characteristics |
| Loctite® 1942™ Hysol® Hot Melt Adhesive | Medium setting, general purpose hot melt adhesive |
| Loctite® 1C-LV™ Hysol® Epoxy Adhesive | High temperature and chemical resistant, gap filling, impact resistant, medium viscosity |
| Loctite® 1C™ Hysol® Epoxy Adhesive | High temperature and chemical resistant, gap filling high viscosity paste |
| Loctite® 1X™ Hysol® Hot Melt Adhesive | Medium to fast setting, hot melt adhesive |
| Loctite® 1X™ Hysol® Hot Melt Adhesive | Medium setting adhesive |
| Loctite® 200™ Dri-Loc® | High strength, preapplied threadlocker |
| Loctite® 201™ Dri-Loc® | High strength, high temperature, preapplied threadlocker |
| Loctite® 2020™ Brass-Loc® | Low to medium strength, preapplied threadlocker designed for brass |
| Loctite® 202™ Dri-Loc® | Medium strength, preapplied threadlocker and sealant |
| Loctite® 2033™ Threadlocker Gel | Medium strength threadlocker gel, no run formula |
| Loctite® 203™ Dri-Loc® | Low strength, preapplied threadlocker designed for fasteners with phosphate and oil coatings |
| Loctite® 2045™ Dri-Loc® | High strength, high temperature, preapplied threadlocker designed for plated fasteners |
| Loctite® 2046™ Threadlocker | The only threadlocker compliant with FDA food additive regulations developed specifically for the Food and Beverage industries. |
| Loctite® 2047™ Threadlocker | High lubricity, high strength threadlocker for large bolts |
| Loctite® 204™ Dri-Loc® | High strength, preapplied threadlocker designed for fasteners with plated surfaces |
| Loctite® 205™ Dri-Loc® | High strength, preapplied threadlocker with high lubricity |
| Loctite® 2060 UV™ Dri-Loc® | Medium to high strength, preapplied threadlocker with own microcaps |
| Loctite® 220™ Threadlocker | Medium strength, wicking grade threadlocker for small screws. |
| Loctite® 222MS™ Threadlocker | Low strength threadlocker for small screws & military applications. |
| Loctite® 222™ Threadlocker | Low strength threadlocker for small screw. |
| Loctite® 232™ Retaining Compound | Medium strength retaining compound for heavy interferences and high torque |
| Loctite® 236™ Hysol® Hot Melt Adhesive | Highly flexible, 60-second open time EVA hot melt |
| Loctite® 2422™ Threadlocker | High temperature, medium strength threadlocker |
| Loctite® 2423™Threadlocker | Low Odor, Medium Strength Threadlocker |
| Loctite® 242® Threadlocker | Medium strength, general purpose threadlocker. |
| Loctite® 2432™ Threadlocker | Medium strength threadlocker for active & inactive metals. |
| Loctite® 243™ Threadlocker | General purpose, medium strength, oil resistant threadlocker. |
| Loctite® 246™ Threadlocker | Medium strengh threadlocker for heavy duty applications. |
| Loctite® 25062 Anaerobic Activator | Activator for anaerobics |
| Loctite® 2620™ Threadlocker | High temperature, high strength threadlocker |
| Loctite® 262™ Threadlocker | Medium - high strength threadlocker. |
| Loctite® 266™ Threadlocker | High strength, surface insensitive, high temperature threadlocker. |
| Loctite® 271™ Threadlocker | High strength, low viscosity threadlocker. |
| Loctite® 272™ Threadlocker | High strength, fast curing, high temperature threadlocker. |
| Loctite® 2760™ Threadlocker | High strength, surface insensitive threadlocker. |
| Loctite® 277™ Threadlocker | High strength threadlocker. |
| Loctite® 290™ Threadlocker | Medium - high strength threadlocker for pre-assembled parts. |
| Loctite® 294™ Threadlocker | Medium - high strength, high temperature, wicking grade threadlocker for pre-assembled parts. |
| Loctite® 30-Second Bonder | Toughened, activator-cure acrylic |
| Loctite® 3030™ Adhesive, Polyolefin Bonder | General purpose acrylic adhesive, designed to bond untreated low energy substrates such as polypropylene |
| Loctite® 3032™ | General purpose acrylic adhesive, designed to bond untreated low energy substrates such as polypropylene |
| Loctite® 3034™ | General purpose acrylic adhesive, designed to bond untreated low energy substrates such as polypropylene |
| Loctite® 3038™ | Adhesive designed to bond e-coated metals to glass fiber filled polypropylenes. |
| Loctite® 3050™ Structural Adhesive | A weld-through capable, high temperature, acid resistant, two component acrylic adhesive designed for weld / rivet reduction. |
| Loctite® 3051™ Light Cure Medical Device Adhesive | |
| Loctite® 3060™ Structural Adhesive | Two-component, acid-free, toughened external-mix acrylic requires no static mixing or activators. Turns green when mixed. Excellent high temperature resistance. |
| Loctite® 3100™ Light Cure Adhesive | Low modulus, high viscosity, UV/V light cure adhesive. |
| Loctite® 3101™ Light Cure Adhesive | Low modulus, high viscosity, UV/V light cure adhesive. |
| Loctite® 3102™ Light Cure Adhesive | |
| Loctite® 3103™ Light Cure Adhesive | Thixotropic, flexible, low modulus, medium viscosity, UV/V light cure adhesive. |
| Loctite® 3104™ Light Cure Adhesive | High strength, low viscosity, UV/V light cure adhesive. |
| Loctite® 3105™ Light Cure Adhesive | High strength, low viscosity, UV/V light cure adhesive. |
| Loctite® 3106™ Light Cure Adhesive | High strength, medium viscosity, thixotropic UV/V light cure adhesive. |
| Loctite® 3107™ Light Cure Adhesive | Low viscosity, UV/V light cure adhesive. |
| Loctite® 3108™ Light Cure Adhesive | Low durometer, rubbery, UV cure adhesive. |
| Loctite® 312™ Speedbonder™ Structural Adhesive | Two-step, no-mix, fast fixturing, low viscosity adhesive |
| Loctite® 3140™ Hysol® Epoxy Resin, General Purpose | Epoxy resin, part of a two part system to be used with a hardener, formulated for general purpose potting and encapsulating |
| Loctite® 3141™ Hysol® Epoxy Resin, High Temperature | Epoxy resin, part of a two part system to be used with a hardener, formulated for high temperature potting and encapsulating |
| Loctite® 3142™ Hysol® Epoxy Resin, Thermally Conductive | Epoxy resin, part of a two part system to be used with a hardener, formulated for thermally conductive potting and encapsulating |
| Loctite® 3145™ Hysol® Epoxy Resin, Flame Retardant | Epoxy resin, part of a two part system to be used with a hardener, formulated for flame retardant potting and encapsulating |
| Loctite® 315™ Output™ | Self-shimming thermally conductive, one part adhesive for bonding electrical components to heat sinks with an insulating gap |
| Loctite® 3160™ Hysol® Epoxy Hardener, Glossy Surface Finish | Epoxy hardener, part of a two part system to be used with a resin, formulated for glossy surface finish potting and encapsulating |
| Loctite® 3162™ Hysol® Epoxy Hardener, Fast Cure | Epoxy hardener, part of a two part system to be used with a resin, formulated for fast cure potting and encapsulating |
| Loctite® 3163™ Hysol® Epoxy Hardener, Excellent Adhesion | Epoxy hardener, part of a two part system to be used with a resin, formulated for fast cure potting and encapsulating |
| Loctite® 3164™ Hysol® Epoxy Hardener, General Purpose | Epoxy hardener, part of a two part system to be used with a resin, formulated for general purpose potting and encapsulating |
| Loctite® 3165™ Hysol® Epoxy Hardener, Low Shrinkage | Epoxy hardener, part of a two part system to be used with a resin, formulated for low shrinkage potting and encapsulating |
| Loctite® 3173™ Hysol® Polyurethane Resin, General Purpose | Polyurethane resin, part of a two part system to be used with a hardener, formulated for general purpose potting and encapsulating |
| Loctite® 3175™ Light Cure Adhesive | Medium viscosity, solvent free, UV light cure adhesive. |
| Loctite® 3182™ Hysol® Polyurethane Hardener, Fast Cure | Polyurethane hardener, part of a two part system to be used with a resin, formulated for gast curing potting and encapsulating |
| Loctite® 3183™ Hysol® Polyurethane Hardener, General Purpose | Polyurethane hardener, part of a two part system to be used with a resin, formulated for general purpose potting and encapsulating |
| Loctite® 3184™ Hysol® Polyurethane Hardener, Flame Retardant | Polyurethane hardener, part of a two part system to be used with a resin, formulated for flame retardant potting and encapsulating |
| Loctite® 3201™ Light Cure Adhesive | High viscosity, flexible, UV/V, light cure adhesive. |
| Loctite® 3211™ Light Cure Adhesive, Polycarbonate/Thermoplastics | Thixotropic, flexible, UV/V, light cure adhesive. |
| Loctite® 324™ Speedbonder™ Structural Adhesive, High Impact | Two-step, no-mix, high impact, solvent resistant, gap filling adhesive |
| Loctite® 325™ Speedbonder™, High Temperature | Two-step, no-mix, high temperature, solvent resistant, gap filling adhesive |
| Loctite® 326™ Speedbonder™ Structural Adhesive, Fast Fixture | Two-step, no-mix, fast fixturing, general purpose, solvent resistant adhesive |
| Loctite® 3301™ Light Cure Adhesive, Plastic/Metal | Low viscosity, slightly flexible, UV/V light cure adhesive. |
| Loctite® 330™ Depend® Adhesive, No-Mix | Two-step, no-mix, general purpose, high viscosity, multi-surface adhesive |
| Loctite® 3311™ Light Cure Adhesive, Plastic/Metal | Low viscosity, slightly flexible, UV/V light cure adhesive. |
| Loctite® 331™ | Single-component, toughened, activator-cure acrylic. |
| Loctite® 3321™ Light Cure Adhesive, Plastic/Metal | Medium viscosity, slightly flexible, UV/V light cure adhesive. |
| Loctite® 332™ Structural Adhesive, Severe Environment | Two-step, no-mix, high temperature, high viscosity, adhesive |
| Loctite® 3335™ Light Cure Adhesive, UV Cationic Epoxy | Rigid, one-part, high temperature resistance, excellent surface cure, low shrinkage, and low outgassing |
| Loctite® 3336™ Light Cure Adhesive | Semi-rigid, two-part, medium viscosity epoxy, curable at room temperature or with heat |
| Loctite® 3337™ Light Cure Adhesive, UV Cationic Epoxy | Semi-rigid, general purpose, one-part, medium viscosity epoxy with excellent surface cure, low shrinkage, low outgassing |
| Loctite® 3340™ Light Cure Adhesive, UV Cationic Epoxy | Semi-rigid, chemically resistant, one-part, medium viscosity epoxy with excellent surface cure, low shrinkage, low outgassing |
| Loctite® 3341™ Light Cure Adhesive, Plasticized Substrates | Low viscosity, UV/V light cure adhesive. |
| Loctite® 3345™ Light Cure Adhesive, Glass/Metal | Medium viscosity, UV light cure adhesive |
| Loctite® 334™ Structural Adhesive, High Performance | One-part dual-cure, toughened, high viscosity, magnet bonding adhesive |
| Loctite® 3355™ Light Cure Adhesive, Pre-Activated Epoxy | Semi-flexible, UV/Visible light activated epoxy; delay curing, one-part, extremely low shrinkage, low outgass, and acid free |
| Loctite® 3381™ Light Cure Adhesive, Flexible/Plastics | Medium viscosity, flexible, UV light cure adhesive. |
| Loctite® 3407™ OptiLOC® Fiber Optic Adhesive, Silicone/Heat Cure | One part, heat cure silicone |
| Loctite® 3491™ Light Cure Adhesive | Medium viscosity, UV light cure adhesive. |
| Loctite® 3492™ Light Cure Adhesive | Low viscosity, UV light cure adhesive. |
| Loctite® 3493™ Light Cure Adhesive | High viscosity, UV light cure adhesive. |
| Loctite® 3494™ Light Cure Adhesive | Medium viscosity, durable, UV/V light cure adhesive. |
| Loctite® 349™ Impruv® Light Cure Adhesive | High viscosity, UV light cure adhesive. |
| Loctite® 3509™ | One component heat cure epoxy designed for use as board level cornerbond for IC packages, such as CSPs and BGAs |
| Loctite® 3515™ | One component epoxy adhesive, designed to allow self-alignment of SMT components during the reflow operation |
| Loctite® 3517™ | One part, heat curable epoxy, designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices |
| Loctite® 3518™ | One part, heat curable epoxy, designed as non-reworkable CSP/BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices |
| Loctite® 3525™ Light Cure Adhesive | High viscosity, UV/V light cure adhesive. |
| Loctite® 3526™ Light Cure Acrylic | UV/V/Heat cure version of Loctite® 3525 |
| Loctite® 352™ Light Cure Adhesive | High viscosity, tough, flexible, vibration resistant UV light cure adhesive. |
| Loctite® 3548™ | Fast flow, low temperature cure, reworkable epoxy underfill for BGA and CSP devices |
| Loctite® 3549™ | Fast flow, low temperature cure, reworkable epoxy underfill for BGA and CSP devices |
| Loctite® 3551™ CSP Underfill | One component heat cure epoxy designed for use as board level underfill for IC packages, such as CSPs and BGAs |
| Loctite® 3552™ Light Cure Adhesive | Low viscosity, fluorescing, visible light cure adhesive. |
| Loctite® 3553™ Light Cure Adhesive | High viscosity, fluorescing, visible light cure adhesive. |
| Loctite® 3554™ Indigo™ Light Cure Adhesive | Low viscosity, fluorescing, visible light cure adhesive. |
| Loctite® 3555™ Indigo™ Light Cure Adhesive | Medium viscosity, fluorescing, visible light cure adhesive. |
| Loctite® 3556™ Indigo™ Light Cure Adhesive | High viscosity, fluorescing, visible light cure adhesive. |
| Loctite® 3593™ | Rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for chip size packages |
| Loctite® 3611™ | Stencil printable, pin transfer product for the bonding of surface mounted devices to printed circuit boards prior to wave soldering |
| Loctite® 3616™ Chipbonder Adhesive | Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering |
| Loctite® 3621™ Chipbonder Adhesive | Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering |
| Loctite® 3627™ Chipbonder Adhesive | Dispensable and DEK® Proflow™ printable product for bonding of surface mounted devices to printed circuit boards prior to wave soldering |
| Loctite® 3629™ Chipbonder Adhesive | Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering |
| Loctite® 3631™ Hysol® Urethane Hot Melt Adhesive | Toughened, high strength moisture cure, hot melt adhesive |
| Loctite® 363™ Impruv® Light Cure Adhesive | Low viscosity, UV light cure adhesive. |
| Loctite® 3650™ Hysol® Polyolefin Hot Melt Adhesive | Polyolefin hot melt for plastic bonding |
| Loctite® 3651™ Hysol® Polyolefin Hot Melt Adhesive | Polyolefin hot melt for plastic bonding |
| Loctite® 3662™ | Halogen-free, single component, medium viscosity, UV anaerobic structural adhesive |
| Loctite® 366™ Light Cure Adhesive | Medium viscosity, UV light cure adhesive. |
| Loctite® 3751™ LiteTak® Light Cure Adhesive | Medium viscosity, solvent free UV light cure adhesive. |
| Loctite® 3761™ LiteTak® Light Cure Adhesive | Medium viscosity, solvent free, UV light cure adhesive. |
| Loctite® 380™ Black Max® Instant Adhesive, Toughened | Low viscosity, black, rubber toughened, one part, room temperature cure, instant adhesive. |
| Loctite® 382™ Tak Pak® Ultra Performance Instant Adhesive | High viscosity, one part, room temperature cure, instant adhesive. |
| Loctite® 383™ Output™ | Thermally conductive adhesive system designed for bonding heat generating components to heat sinks |
| Loctite® 384™ Output™ | Thermally conductive adhesive system designed for bonding heat generating components to heat sinks |
| Loctite® 3860™ | Medium viscosity versatile epoxy casting system that exhibits high thermal conductivity and low thermal expansion |
| Loctite® 3861™ | Low viscosity, versatile epoxy casting system that exhibits high thermal conductivity and low thermal expansion |
| Loctite® 3862™ | Medium viscosity electronic potting system designed to provide superior thermal shock resistance and high thermal conductivity |
| Loctite® 3865HV™ | A two-component, UV curing epoxy |
| Loctite® 3866™ | Low viscosity epoxy resin |
| Loctite® 3873™ | Self-shimming, thermally conductive adhesive |
| Loctite® 3874™ Thermally Conductive Adhesive | Thermally conductive adhesive |
| Loctite® 3875™ | Bead on bead thermally conductive adhesive, is a two-part filled acrylic thermally conductive adhesive designed for ease of use |
| Loctite® 3876™ | Self-shimming bead on bead thermally conductive adhesive, is a two-part filled acrylic thermally conductive adhesive designed for ease of use |
| Loctite® 3880™ | Designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required |
| Loctite® 3888™ | Bonds metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required |
| Loctite® 3900™ | Clear acrylic formulated without chlorinated solvents or CFC's |
| Loctite® 3911™ Light Cure Adhesive | Low viscosity, UV/V light cure adhesive. |
| Loctite® 3912™ Light Cure Adhesive | Medium viscosity, UV/V light cure adhesive. |
| Loctite® 3913™ Light Cure Adhesive | Medium viscosity, UV/V light cure adhesive. |
| Loctite® 3921™ Light Cure Adhesive, Plastic/Metal | Low viscosity, UV/V light cure adhesive, fluorescing, sterilization resistance. |
| Loctite® 3922™ Light Cure Adhesive, Plastic/Metal | Low viscosity UV/V light curing adhesive, fluorescing, sterilization resistance. |
| Loctite® 3924™ Light Cure Adhesive, Plastic/Metal | Medium viscosity UV/V light curing adhesive, fluorescing, sterilization resistance. |
| Loctite® 3926™ Light Cure Adhesive, Plastic/Metal | High viscosity UV/V light curing adhesive, fluorescing, sterilization resistance. |
| Loctite® 392™ Structural Adhesive, Fast Fixture/Magnet Bonder | One-part dual-cure, toughened, high viscosity, magnet bonding adhesive |
| Loctite® 3933™ Light Cure Adhesive | Medium viscosity, thixotropic, UV/V light curing adhesive, fluorescing, sterilization resistance. |
| Loctite® 3936™ Light Cure Adhesive, High Performance/Various Substrates | High viscosity, UV/V light curing adhesive, fluorescing, sterilization resistance. |
| Loctite® 3941™ Light Cure Adhesive, High Performance/Various Substrates | Low viscosity, UV/V light curing adhesive, fluorescing, sterilization resistance. |
| Loctite® 3942™ Light Cure Adhesive, High Performance/Various Substrates | Medium viscosity, UV/V light curing adhesive, fluorescing, sterilization resistance. |
| Loctite® 3943™ Light Cure Adhesive, High Performance/Various Substrates | High viscosity, UV/V light curing adhesive, fluorescing, sterilization resistance. |
| Loctite® 3944™ Light Cure Adhesive | Medium viscosity, UV/V light curing adhesive, fluorescing. |
| Loctite® 3971™ Light Cure Adhesive | Low viscosity, UV/V light curing adhesve, fluorescing |
| Loctite® 3972™ Light Cure Adhesive | Medium viscosity, UV/V light curing adhesive, fluorescing. |
| Loctite® 3974™ Light Cure Adhesive | Flexible, high viscosity UV/visible light cure acrylic adhesive |
| Loctite® 3981™ Hysol® Epoxy Adhesive, High Performance/Various Substrates | One-part, heat cure, toughened, highly flourescent, low viscosity epoxy |
| Loctite® 3982™ Hysol® Epoxy Adhesive, High Performance/Various Substrates | One-part, heat cure, toughened, highly flourescent, medium viscosity epoxy |
| Loctite® 3984™ Hysol® Epoxy Adhesive, High Performance/Various Substrates | One-part, heat cure, toughened, highly flourescent, high viscosity epoxy |
| Loctite® 3985™ Hysol® Epoxy Adhesive, Non-sag | One-part, heat-cure, toughened, non-sag, high viscosity, motor armature bonding epoxy |
| Loctite® 3X™ Hysol® Polyshot™ Hot Melt Adhesive | Used extensively for bonding sand molds and other porous substrates. |
| Loctite® 4011™ Prism® Medical Device Adhesive | Low viscosity, surface insensitive, one part, room temperature cure, instant adhesive. |
| Loctite® 4013™ Prism® Medical Device Adhesive | Medium viscosity, one-part room temperature cure, instant adhesive. |
| Loctite® 4014™ Prism® Medical Device Adhesive | Very low viscosity, one-part room temperature cure, instant adhesive. |
| Loctite® 401™ Prism® Instant Adhesive, Surface Insensitive | Low viscosity, surface insensitive, one part, room temperature cure, instant adhesive. |
| Loctite® 4031™ Prism® Medical Device Adhesive | Very low viscosity, low odor/low bloom, surface insensitive adhesive |
| Loctite® 403™ Prism® Instant Adhesive, Low Odor/Low Bloom | High viscosity, low odor/low bloom, one part room temperature cure, instant adhesive. |
| Loctite® 4046™ Hysol® Hot Melt Adhesive | Highly flexible, 60-second open time EVA hot melt |
| Loctite® 404™ Quick Set" Instant Adhesive, General Purpose | General maintenance and repair, one part, room temperature cure, instant adhesive. |
| Loctite® 4061™ Prism® Medical Device Adhesive | Wicking grade, surface insensitive, one part, room temperature cure, instant adhesive. |
| Loctite® 406™ Prism® Instant Adhesive, Surface Insensitive | Wicking grade, surface insensitive, one part, room temperature cure, instant adhesive. |
| Loctite® 4081™ Prism® Medical Device Adhesive | Very low viscosity, low odor/low bloom, one part room temperature cure, instant adhesive. |
| Loctite® 408™ Prism® Instant Adhesive, Low Odor/Low Bloom | Very low viscosity, low odor/low bloom, one part room temperature cure, instant adhesive. |
| Loctite® 409™ Super Bonder® Instant Adhesive | General purpose instant adhesive gel |
| Loctite® 410™ Prism® Instant Adhesive, Black/Toughened | High viscosity, black, rubber toughened, one part, room temperature cure, instant adhesive. |
| Loctite® 411™ Prism® Instant Adhesive, Clear Toughened | High viscosity, clear toughened, one part, room temperature cure, instant adhesive. |
| Loctite® 412™ Super Bonder® Instant Adhesive | |
| Loctite® 414™ Super Bonder® Instant Adhesive | |
| Loctite® 415™ Super Bonder® Instant Adhesive | |
| Loctite® 4161™ Super Bonder® Instant Adhesive | High viscosity, one-part room temperature cure, instant adhesive. |
| Loctite® 416™ Super Bonder® Instant Adhesive | |
| Loctite® 417™ Super Bonder® Instant Adhesive | |
| Loctite® 4203™ Prism® Instant Adhesive, Thermal Resistant | Low viscosity, thermal resistant, clear, rubber toughened, one part, room temperature cure, instant adhesive. |
| Loctite® 4204™ Prism® Instant Adhesive, Thermal Resistant | High viscosity, thermal resistant, clear, rubber toughened, one part, room temperature cure, instant adhesive. |
| Loctite® 4205™ Prism® Instant Adhesive, Thermal Resistant | Gel, thermal resistant, clear, rubber toughened, one part, room temperature cure, instant adhesive. |
| Loctite® 4206™ Prism® Medical Device Adhesive | |
| Loctite® 420™ Super Bonder® Instant Adhesive | |
| Loctite® 422™ Super Bonder® Instant Adhesive | |
| Loctite® 425™ Assure™ Instant Adhesive, Surface Curing Threadlocker | Low viscosity, threadlocking, one part, room temperature cure, instant adhesive. |
| Loctite® 426™ Prism® Instant Adhesive, Black/Toughened Gel | Gel, black, rubber toughened, one part, room temperature cure, instant adhesive. |
| Loctite® 4305™ Prism® Medical Device Adhesive | High viscosity, low odor/low bloom, one part room temperature cure, instant adhesive. |
| Loctite® 4306™ Flashcure® Light Cure Adhesive | Low viscosity, one part, UV/V light rapid cure, instant adhesive. |
| Loctite® 4307™ Flashcure® Light Cure Adhesive | High viscosity, one part, UV/V light rapid cure, instant adhesive. |
| Loctite® 430™ Super Bonder® Instant Adhesive | |
| Loctite® 431™ Prism® Instant Adhesive, Surface Insensitive | High viscosity, gap filling, surface insensitive, one part, room temperature cure, instant adhesive. |
| Loctite® 435™ Prism® Instant Adhesive, Clear/Toughened | Low viscosity, clear, surface insensitive, rubber toughened, one part, room temperature cure, instant adhesive. |
| Loctite® 438™ Prism® Instant Adhesive, Black/Toughened | Low viscosity, black, surface insensitive, rubber toughened, one part, room temperature cure, instant adhesive. |
| Loctite® 444™ Tak Pak® Instant Adhesive | Medium viscosity instant adhesive for electronics tacking |
| Loctite® 4541™ Prism® Medical Device Adhesive | Gel, one part, surface insensitive, room temperature cure, instant adhesive. |
| Loctite® 454™ Prism® Instant Adhesive, Surface Insensitive Gel | Gel, one part, surface insensitive, room temperature cure, instant adhesive. |
| Loctite® 455™ Prism® Instant Adhesive Gel, Low Odor/Low Bloom | Gel, low odor/low bloom, one part room temperature cure, instant ad |