Electronics
Henkel: The choice for today’s advanced semiconductor and electronics assembly markets
In
the fast-paced electronics industry, product sophistication and
manufacturing techniques evolve quickly. That’s why so many top
semiconductor and electronics solutions firms rely on Henkel to deliver
the enabling materials they require to produce leading-edge products in
an ever-tightening time-to-market window. From wafer-level to
board-level through to final assembly, Henkel’s world-renowned
Ablestik™, Acheson™, Emerson & Cuming™, Hysol®, Loctite® and Multicore®
product portfolios provide today’s electronics specialists with the
proven, reliable and compatible material solutions they need to stay
competitive.
Electronics solutions
Though the
majority of the industry had transitioned to lead-free manufacturing,
ongoing product advances, device miniaturization and pending
halogen-free legislation still pose challenges to even the most
technically adept firms. With decades of materials science expertise
as its foundation, Henkel is delivering solutions today for tomorrow’s
electronics requirements.
Through its line of Acheson conductive inks and coatings, Emerson & Cuming Electrically conductive and non-conductive adhesives, Multicore solder materials, Loctite Chipbonder® adhesives, Hysol CSP underfills and a wide range of conformal coatings and PCB
protection materials, Henkel is leading the way for next-generation
product development. No other materials supplier offers the breadth of
products, depth of supply chain or global presence that Henkel
delivers, giving customers outstanding performance and a low-risk
proposition.
Semiconductor assembly
Driven by
consumers’ relentless push for smaller, yet more powerful and less
costly products, semiconductor specialists are constantly pushing the
envelope when it comes to device packaging. Thinner die, more complex
devices, tighter pitches and reduced dimensions are defining the future
of the semiconductor packaging market and Henkel is at the forefront of
innovative materials development for next-generation products.
Henkel’s Ablestik brand of die attach adhesives in paste, self-filleting, wafer backside coating (WBC) and film formats are arguably the market’s most
well-known die attach products. The semiconductor materials portfolio
also includes Hysol wafer-level underfills, mold compounds and encapsulants and Multicore Accurus™ high performance solder spheres.
The importance of compatibility
Henkel’s
unique material set philosophy ensures that all of our materials are
designed with compatibility in mind. Both in process and in the field,
Henkel’s products deliver performance, reliability and the peace of
mind that comes with 24/7 global support and unmatched engineering
expertise.
> View or download the new Printed Circuit Board Assembly Solutions Catalog
> View or download the new Semiconductor Solutions Catalog
> Global Semiconductor Sales Offices
> To obtain an Electronics Assembly Product Material Safety Data Sheet, call 1-978-436-9700.
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