Potting & Encapsulating
Compounds used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components from exposure to chemicals, moisture, mechanical shock and vibration.
Aerospace - Potting
To fill honeycomb core with a thermoset resin to increase fastener retention.
Automotive Component - Potting
To surround, coat or envelop an automotive component in a solid or liquid resin to protect it from environmental conditions.
Thermoset potting materials that have low exothermatic conditions allowing for large mass or deep sections.
A broad range of materials used to surround, coat or envelop a part or component in a solid or liquid resin to protect it from environmental conditions.
A thermosetting resin used chiefly in strong adhesives, coatings and laminates.
Low viscosity resins that flow into voids.
A thermoplastic material that is melted and applied in a molten state.
One-component adhesive/sealant that cures to a tough rubbery solid upon exposure to moisture in the air.
One or two-part adhesives that provide high strength bonds on a wide variety of substrates.
PCB Protection Encapsulants - Potting
Epoxy Encapsulants-Potting, One Component
Epoxy Encapsulants-Potting, Two Component
Urethane Encapsulants-Potting, Two Component
Potting & Encapsulating - Electronics
To surround, coat or envelop an electronic component in a liquid resin to protect it from environmental conditions.
To surround, coat or envelop an electronic component in a solid or liquid resin to protect it from environmental conditions.
Dam encapsulants are used in packaging assembly designed to encapsulate semiconductor components. They are used in conjunction with fill encapsulants which are much lower in viscosity allowing even distribution of encapsulants inside the dam encapsulants.
Glob Top Materials
Encapsulants used without dams designed to encapsulate semiconductor packaging assemblies. Glob Top encapsulants are dispensed directly onto semiconductor chips to protect wire bonds and wafer.
Opto encapsulants are high performance encapsulants designed with specific optical performance requirements. Typical applications include Light Emitting Diodes (LEDS). Other types of opto encapsulants may be used in brake lights, flashlights and fiber optics.
Having the quality or power of conducting heat.
Fill encapsulants are used in packaging assembly designed to encapsulate semiconductor components. Fill materials are used with dam materials, which are much higher in viscosity, so the fill encapsulants stay within the dam.
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