Potting & Encapsulating

Aerospace - Potting

To fill honeycomb core with a thermoset resin to increase fastener retention.

Automotive Component - Potting

To surround, coat or envelop an automotive component in a solid or liquid resin to protect it from environmental conditions.

Deep-Section Cure

Thermoset potting materials that have low exothermatic conditions allowing for large mass or deep sections.

General Industrial

A broad range of materials used to surround, coat or envelop a part or component in a solid or liquid resin to protect it from environmental conditions.

Epoxy

A thermosetting resin used chiefly in strong adhesives, coatings and laminates.

Flowable
Low viscosity resins that flow into voids.

High Strength

Hot Melt

A thermoplastic material that is melted and applied in a molten state.

Silicones

One-component adhesive/sealant that cures to a tough rubbery solid upon exposure to moisture in the air.

Urethanes
One or two-part adhesives that provide high strength bonds on a wide variety of substrates.

PCB Protection Encapsulants - Potting

Epoxy Encapsulants-Potting, One Component

Epoxy Encapsulants-Potting, Two Component

Urethane Encapsulants-Potting, Two Component

Potting & Encapsulating - Electronics

Potting
To surround, coat or envelop an electronic component in a liquid resin to protect it from environmental conditions.

Encapsulating
To surround, coat or envelop an electronic component in a solid or liquid resin to protect it from environmental conditions.

Dam Encapsulants

Dam encapsulants are used in packaging assembly designed to encapsulate semiconductor components. They are used in conjunction with fill encapsulants which are much lower in viscosity allowing even distribution of encapsulants inside the dam encapsulants.

Glob Top Materials

Encapsulants used without dams designed to encapsulate semiconductor packaging assemblies.  Glob Top encapsulants are dispensed directly onto semiconductor chips to protect wire bonds and wafer.

Opto Encapsulants

Opto encapsulants are high performance encapsulants designed with specific optical performance requirements. Typical applications include Light Emitting Diodes (LEDS). Other types of opto encapsulants may be used in brake lights, flashlights and fiber optics.

 

Lid Attach

Having the quality or power of conducting heat.

Fill Materials

Fill encapsulants are used in packaging assembly designed to encapsulate semiconductor components.  Fill materials are used with dam materials, which are much higher in viscosity, so the fill encapsulants stay within the dam.