Molding Compounds

Low Pressure Molding Compounds

Low pressure molding is a polymide hot melt adhesive designed as a viable solution to encapsulate printed circuit boards (PCB). Applications include small circuit boards for consumer electronics.

Polyamide Low Pressure Molding Compounds

Polyolefin Low Pressure Molding Compounds

Opto-Electronic Molding Compounds

Mold compounds designed with high optical properties. Typical applications would include (LED's) light emitting diodes used in many lighting applications including brake lights, flash lights and standard electronic equipment like DVD's as indicator lights.

PCB Molding Compounds

Protect passive components such as ceramic and tantalum capacitors and resistors designed for both automolds and conventional molds.

Semiconductor Molding Compounds

Molding materials are used to encapsulate semiconductor packaging. Integrated Circuits (IC) are bonded down to packaging with die attach materials and encapsulated with mold compounds to protect the circuit. Applications include TSOP's QFP's, QFN's, SOIC's, CSP's, BGA's along with several other standard SMT devices.

Tantalum Capacitor Molding

Resistor Network Molding

Through-Hole Discretes

Through-Hole Discretes, High Thermal Conductivity

Through-Hole Discretes, High Voltage Applications

Surface Mount / Lead Frames

Surface Mount / Laminates

Green Molding Compounds

Non-Green Molding Compounds

Other Semiconductor Molding Compounds