The forming of a resin/fiber material into a solid mass of prescribed shape and size.
Low Pressure Molding Compounds
Low pressure molding is a polymide hot melt adhesive designed as a viable solution to encapsulate printed circuit boards (PCB). Applications include small circuit boards for consumer electronics.
Polyamide Low Pressure Molding Compounds
Polyolefin Low Pressure Molding Compounds
Opto-Electronic Molding Compounds
Mold compounds designed with high optical properties. Typical applications would include (LED's) light emitting diodes used in many lighting applications including brake lights, flash lights and standard electronic equipment like DVD's as indicator lights.
PCB Molding Compounds
Protect passive components such as ceramic and tantalum capacitors and resistors designed for both automolds and conventional molds.
Semiconductor Molding Compounds
Molding materials are used to encapsulate semiconductor packaging. Integrated Circuits (IC) are bonded down to packaging with die attach materials and encapsulated with mold compounds to protect the circuit. Applications include TSOP's QFP's, QFN's, SOIC's, CSP's, BGA's along with several other standard SMT devices.
Tantalum Capacitor Molding
Resistor Network Molding
Through-Hole Discretes, High Thermal Conductivity
Through-Hole Discretes, High Voltage Applications
Surface Mount / Lead Frames
Surface Mount / Laminates
Green Molding Compounds
Non-Green Molding Compounds
Other Semiconductor Molding Compounds
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